# US 10,246,320 B2 · Packages and methods of packaging sensors > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,246,320 B2 - Document ID: US10246320B2 - Status: Granted - Kind: B2 - Application number: 15/220,048 - Filed: 2016-07-26 - Published: 2018-02-01 - Granted: 2019-04-02 - Earliest claimed: 2016-07-26 - Assignees: Dunan Sensing, LLC - Applicants: DunAn Sensing, LLC - Inventors: Danny (Duy) Do; Tom Nguyen; Kevin Cuong Nguyen; Claudio Martinez - Web page: https://patentgrep.com/patent/US10246320B2 ## CPC - B81B 7/007: {Interconnections between the MEMS and external electrical signals} - B81C 1/0023: {Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261)} - B81C 1/00301: {Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias} - G01L 19/0076: {using buried connections} - G01L 19/148: {Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation} - B81B 2201/0264: Pressure sensors - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) ## Abstract Sensor packages and methods of assembling a sensor in a sensor package are provided. A preferred embodiment comprises: a base including a sensor coupled to the base wherein the base has at least one electrical connection location and a first mechanical mating interface in the shape of an arc; an electronics package with at least one electrical connection location; and a ring coupled between the base and the electronics package wherein the ring electrically connects the at least one electrical connection location on the base and the at least one electrical connection location on the electronics package and wherein the base has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface. ## Claims ### Claim 1 A sensor package comprising: a base including a sensor coupled to the base wherein the base has a first electrical connection location and a first mechanical mating interface in the shape of an arc; an electronics package with a second electrical connection location; and a ring coupled between the base and the electronics package and having a recessed ledge on a top side of the rind designed to receive the electronics package, wherein the ring electrically connects the first electrical connection location to the second electrical connection location and wherein the ring has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface; and a plurality of vias that terminate on the recessed ledge in first via termination points and wherein a first recessed pocket is formed in the recessed ledge surrounding each first via termination point. ### Claim 2 (depends on 1) The sensor package of claim 1, wherein the first and second mechanical mating interfaces are a groove and protrusion combination. ### Claim 3 (depends on 2) The sensor package of claim 2, wherein a depth of the groove is 10% or more greater than a height of the protrusion. ### Claim 4 (depends on 3) The sensor package of claim 3, wherein the excess volume of the groove that is not filled by the protrusion is filled with adhesive. ### Claim 5 (depends on 1) The sensor package of claim 1, wherein each via of the plurality of vias passes between the base and the electronics package to provide electrical communication between the base and the electronics package. ### Claim 6 (depends on 5) The sensor package of claim 5, wherein the plurality of vias terminate on a bottom side of the ring in second via termination points and a second recessed pocket is formed around each of the second via termination points. ### Claim 7 (depends on 1) The sensor package of claim 1, wherein each first via termination point has a reciprocal via termination point on a bottom side of the ring and wherein the ring has a second recessed pocket formed in the bottom side surrounding each reciprocal via termination point. ### Claim 8 (depends on 1) The sensor package of claim 1, wherein the sensor is a MEMS sensor. ### Claim 9 (depends on 8) The sensor package of claim 8, wherein the MEMS sensor is a pressure sensor that is mounted to a port that passes through the base. ### Claim 10 (depends on 1) The sensor package of claim 1, wherein the base and the ring are both made from ceramic. ### Claim 11 (depends on 1) The sensor package of claim 1, wherein the base is disk shape and further comprises a fixture alignment slot on an outside surface of the disk. ### Claim 12 (depends on 1) The sensor package of claim 1, wherein a surface of the ring has a tongue and an outside edge of the electronics package has a reciprocal groove. ### Claim 13 (depends on 1) The sensor package of claim 1, wherein the ring further comprises a third mechanical mating interface in the shape of an arc and the base further comprises a fourth mechanical mating interface in the shape of an arc that is reciprocal to the third mechanical mating interface. ### Claim 14 A method of assembling a sensor in a sensor package comprising: aligning a first side of a ring to a base using a first mechanical mating interface in the shape of an arc on the ring and a second mechanical mating interface in the shape of an arc on the base, wherein the base has a sensor coupled to the base; aligning an electronics package with a second side opposite the first side of the ring where the ring has a ledge recessed down from the second side designed to receive the electronics package; filling via holes in the ring with a conductive material to form a plurality of vias such that a first electrical connection location on the base is electrically connected to a second electrical connection location on the electronics package, wherein each via of the plurality of vias terminates in a via termination point on the ledge and wherein each via termination point is surrounded by a recessed pocket; partially filling either the first or second mechanical mating interface with an adhesive; coupling the ring between the base and the electronics package; and curing the adhesive such that the base and ring are affixed. ### Claim 15 (depends on 14) The method of claim 14, further comprising measuring a volume difference between the first mechanical mating interface and the second mechanical mating interface and metering an amount of adhesive used based on the volume difference. ### Claim 16 (depends on 14) The method of claim 14, wherein the first and second mechanical mating interfaces are a groove and protrusion combination. ### Claim 17 (depends on 14) The method of claim 14, wherein the conductive material is a conductive epoxy and the conductive epoxy is used as the adhesive. ### Claim 18 (depends on 14) The method of claim 14, further comprising filling the recessed pockets in the ring with conductive epoxy. ### Claim 19 (depends on 14) The method of claim 14, wherein the base is disk shaped and further comprises a fixture alignment slot on an outside surface of the disk. ### Claim 20 (depends on 14) The method of claim 14, wherein a surface of the ring has a tongue and an outside edge of the electronics package has a reciprocal groove and the tongue is assembled into the groove.