# US 10,245,833 B2 · Liquid ejecting head and method of manufacturing liquid ejecting head

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- Number: US 10,245,833 B2
- Document ID: US10245833B2
- Status: Granted
- Kind: B2
- Application number: 15/860,348
- Filed: 2018-01-02
- Published: 2018-05-03
- Granted: 2019-04-02
- Earliest claimed: 2015-03-10
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Shuichi Tanaka
- Web page: https://patentgrep.com/patent/US10245833B2

## CPC

- B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/1433: {Structure of nozzle plates}
- B41J 2/162: {Manufacturing of the nozzle plates}
- B41J 2/1623: {bonding and adhesion}
- B41J 2/1625: {electroforming}
- B41J 2/1628: {dry etching}
- B41J 2/1629: {wet etching}
- B41J 2/1631: {photolithography}
- B41J 2/1632: {machining}
- B41J 2/1635: {dividing the wafer into individual chips}
- B41J 2/1642: {thin film formation by CVD [chemical vapor deposition]}
- B41J 2/1643: {thin film formation by plating}
- B41J 2/1646: {thin film formation by sputtering}
- B41J 2002/1425: {Embedded thin film piezoelectric element}
- B41J 2002/14362: {Assembling elements of heads}
- B41J 2002/14491: {Electrical connection}
- B41J 2202/18: Electrical connection established using vias
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure-chamber-forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

## Claims

### Claim 1

A method of manufacturing a liquid ejecting head that has a wiring substrate having a first surface that is connected to a driver-element-forming substrate in which rows and a plurality of driver elements are provided, a part of the plurality of driver elements being included in the rows, and a second surface that is on the opposite side to the first surface and that is provided with a driver IC that outputs signals that drive the driver elements in the rows, a wire in the second surface that supplies electrical power to the driver elements and a through wire that extends between the first surface and the second surface, the method comprising:
processing the wiring substrate so as to form a recessed portion that is recessed in the second surface of the wiring substrate in a thickness direction thereof and a through hole that penetrates through the wiring substrate, the wiring substrate being a board made of a silicon single crystal substrate, and
forming the wire by filling a conductive material into the recessed portion and the through wire by filling the conductive material into the through hole.

### Claim 2 (depends on 1)

The method of manufacturing a liquid ejecting head according to claim 1,
wherein the forming of the wire involves forming the conductive material in the recessed portion and the through hole by electroplating.

### Claim 3 (depends on 1)

The method of manufacturing a liquid ejecting head according to claim 1 further comprising:
forming an outer layer wire that covers the second surface side of the wire embedded in the wiring substrate with a conductive material that is different from the conductive material of the wire embedded in the wiring substrate.