Method and arrangement for pre-curing an adhesive layer

A method for pre-curing an adhesive layer bonding a first component to a second component before main curing, comprising:

• heating the adhesive layer by treating an adhesive layer component with a pair of electrodes,
• wherein the pair of electrodes applies a predetermined electrical current to the first component,
• wherein a first electrical current (I1) is applied to the first component with the pair of electrodes for raising a temperature of the adhesive layer above an activation threshold (AT) and thereafter a second electrical current (I2) is applied to the first component with the pair of electrodes for maintaining the temperature of the adhesive layer within a predetermined temperature range (TR) above the activation threshold (AT),
• wherein the first electrical current (I1) is applied to the first component for a time duration (t1) of about 1000 ms to 7000 ms,
• wherein the second electrical current (I2) is applied at a predetermined number of pulses, and each of the pulses is applied to the first component for a time duration (t2) of 300 ms to 700 ms, and
• wherein a mechanical pressure (P) is applied to a surface of the first component and a surface of the second component for a predetermined time duration (t3) during pre-curing of the adhesive layer.