# US 10,245,682 B2 · Laser ablation for wirebonding surface on as-cast surface

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- Number: US 10,245,682 B2
- Document ID: US10245682B2
- Status: Granted
- Kind: B2
- Application number: 14/938,234
- Filed: 2015-11-11
- Published: 2017-05-11
- Granted: 2019-04-02
- Earliest claimed: 2015-11-11
- Assignees: Continental Automotive Systems, Inc.
- Applicants: Continental Automotive Systems, Inc.
- Inventors: Jared Yagoda; Dana Gradler
- Web page: https://patentgrep.com/patent/US10245682B2

## CPC

- B23K 26/3576: {Diminishing rugosity, e.g. by grinding, polishing or smoothing}
- B23K 20/004: {Wire welding}
- H05K 3/26: Cleaning or polishing of the conductive pattern
- H05K 2203/049: Wire bonding
- H05K 2203/107: Using laser light
- H10W 72/075: {of bond wires}
- H10W 72/5363: {the connected ends being wedge-shaped}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of removing material from a surface, which includes the steps of providing a base layer, at least one layer attached to the base layer, an intermediate finish surface, and a bonding interface surface. The intermediate finish surface is formed by removing the at least one layer and a portion of the base layer during a material removal process. The bonding interface surface is formed by a polishing process applied to the intermediate finish surface. There is an oxidation layer which is part of the base layer, as well as a mold release layer and a contamination layer, both of which are part of the at least one layer. The material removal process involves laser etching the at least one layer to create the intermediate finish surface, and the polishing process includes applying a second laser etching to the intermediate finish surface, forming the bonding interface surface.

## Claims

### Claim 1

A casting assembly comprising:
a base layer;
an oxidation layer disposed on the base layer;
a mold release layer disposed on the oxidation layer;
a contamination layer disposed on the mold release layer;
a base layer outer surface being a surface of the contamination layer; and
a bonding interface surface defined by the base layer outer surface, the bonding interface surface formed by:
a material removal process including a first laser etching process applied to a section of the base layer outer surface to remove the contamination layer, the mold release layer, the oxidation layer, and a portion of the base layer to form an intermediate finish surface; and
a material polish process including a second laser etching process applied to the base layer to form the bonding interface surface.

### Claim 2 (depends on 1)

The casting assembly of claim 1, wherein the mold release layer further comprising a mold release material for facilitating the removal of the casting assembly from a mold.

### Claim 3 (depends on 1)

The casting assembly of claim 1, wherein the base layer further comprises a material selected from the group consisting of aluminum, silver, gold, and copper.

### Claim 4 (depends on 1)

The casting assembly having of claim 1, wherein the contamination layer is part of the base layer.

### Claim 5 (depends on 1)

The casting assembly of claim 1, wherein the first laser etching process is different from the second laser etching process.

### Claim 6 (depends on 1)

The casting assembly of claim 1, wherein a roughness of the bonding interface surface is less than 10 μm.

### Claim 7 (depends on 1)

The casting assembly of claim 1, wherein a depth of the bonding interface surface with respect to the base layer outer surface is less than 37.0 μm.