# US 10,245,668 B2 · Fluxing systems, bonding machines including fluxing systems, and methods of operating the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,245,668 B2
- Document ID: US10245668B2
- Status: Granted
- Kind: B2
- Application number: 15/795,387
- Filed: 2017-10-27
- Published: 2018-05-03
- Granted: 2019-04-02
- Earliest claimed: 2016-10-31
- Assignees: Kulicke and Soffa Industries, Inc.
- Applicants: Kulicke and Soffa Industries, Inc.
- Inventors: Daniel P. Buergi; Thomas J. Colosimo, Jr.; Edward T. Laurent; Michael P. Schmidt-Lange
- Web page: https://patentgrep.com/patent/US10245668B2

## CPC

- B23K 3/082: {Flux dispensers; Apparatus for applying flux}
- B23K 1/0016: {Soldering of electronic components}
- B23K 1/203: {Fluxing, i.e. applying flux onto surfaces}
- B23K 3/085: {Cooling, heat sink or heat shielding means}
- B23K 37/003: Cooling means for welding or cutting
- H10W 72/0711: {Apparatus therefor}
- B23K 2101/42: Printed circuits
- H10W 72/07118: {Means for cleaning, e.g. brushes}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07152: {Means for cooling}
- H10W 72/07183: {Means for monitoring}
- H10W 72/07211: {Treating the bond pad before connecting, e.g. by applying flux or cleaning}
- H10W 72/07232: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07233: {Ultrasonic bonding, e.g. thermosonic bonding}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.

## Claims

### Claim 1

A bonding machine comprising:
(a) a bond head assembly including a bonding tool for bonding a semiconductor element to a substrate, the semiconductor element including a plurality of conductive structures; and
(b) a fluxing system including (i) a flux holder defining a cavity for holding flux, and (ii) a fluid source for providing a cooling fluid to cool the flux holder, the cooling fluid being provided by the fluid source to a surface of the flux holder beneath the cavity,
wherein, prior to bonding of the semiconductor element to the substrate, the bonding tool is configured to dip the conductive structures at least partially into the cavity such that the conductive structures contact the flux,
the bonding machine being at least one of a thermocompression bonding machine or a flip chip bonding machine.

### Claim 2 (depends on 1)

The bonding machine of claim 1 wherein the fluid source is a gas supply configured to bring a cooling gas into contact with a portion of the flux holder.

### Claim 3 (depends on 1)

The bonding machine of claim 1 wherein the fluid source is a liquid supply configured to bring a cooling liquid into contact with a portion of the flux holder.

### Claim 4 (depends on 1)

The bonding machine of claim 1 wherein the fluid source directs the cooling fluid to the surface of the flux holder through at least one opening in a support structure supporting the flux holder.

### Claim 5 (depends on 1)

The bonding machine of claim 1 wherein at least one channel is defined by the flux holder, the at least one channel being configured to receive the cooling fluid from the fluid source.

### Claim 6 (depends on 1)

The bonding machine of claim 1 wherein the surface of the flux holder includes a depression following a curved path along at least a portion of a length of the surface, the cooling fluid configured to be directed toward the depression.

### Claim 7 (depends on 1)

The bonding machine of claim 1 further comprising a flux tool configured to pass over an upper surface of the flux holder adjacent the cavity.

### Claim 8 (depends on 1)

The bonding machine of claim 1 further comprising a fluid control system for controlling flow of the cooling fluid from the fluid source.

### Claim 9 (depends on 8)

The bonding machine of claim 8 further comprising at least one sensor for sensing a temperature related characteristic of the flux holder in connection with operation of the fluid control system.

### Claim 10

A method of operating a fluxing system for a bonding machine, the method comprising the steps of:
(a) providing a flux holder on the bonding machine defining a flux cavity, the flux cavity including flux;
(b) providing a bond head assembly on the bonding machine, the bond head assembly including a bonding tool for bonding a semiconductor element to a substrate, the semiconductor element including a plurality of conductive structures;
(c) dipping the conductive structures at least partially into the cavity such that the conductive structures contact the flux prior to bonding the semiconductor element to the substrate; and
(d) directing a cooling fluid from a fluid source to a surface of the flux holder beneath the cavity to cool the flux holder,
the bonding machine being at least one of a thermocompression bonding machine or a flip chip bonding machine.

### Claim 11 (depends on 10)

The method of claim 10 wherein step (d) includes directing a cooling gas from a gas supply into contact with a portion of the flux holder.

### Claim 12 (depends on 10)

The method of claim 10 wherein step (d) includes directing a cooling liquid from a liquid supply into contact with a portion of the flux holder.

### Claim 13 (depends on 10)

The method of claim 10 wherein step (d) includes directing the cooling fluid to the surface of the flux holder through at least one opening in a support structure supporting the flux holder.

### Claim 14 (depends on 10)

The method of claim 10 wherein step (d) includes directing the cooling fluid to at least one channel defined by the flux holder.

### Claim 15 (depends on 10)

The method of claim 10 wherein step (d) includes directing the cooling fluid to the surface of the flux holder, the surface defining a depression following a curved path along at least a portion of a length of the surface.

### Claim 16 (depends on 10)

The method of claim 10 wherein step (d) includes operating a fluid control system for controlling flow of the cooling fluid from the fluid source.

### Claim 17 (depends on 16)

The method of claim 16 further comprising the steps of receiving data from at least one sensor for sensing a temperature related characteristic of the flux holder, and (d) using the data in connection with operation of the fluid control system.

### Claim 18 (depends on 16)

The method of claim 16 wherein step (d) includes operating the fluid control system according to closed loop process for controlling flow of the cooling fluid from the fluid source.

### Claim 19 (depends on 16)

The method of claim 16 wherein step (d) includes operating the fluid control system according to model control process derived using experimental data.