# US 10,245,667 B2 · Chip joining by induction heating

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- Number: US 10,245,667 B2
- Document ID: US10245667B2
- Status: Granted
- Kind: B2
- Application number: 15/654,130
- Filed: 2017-07-19
- Published: 2017-11-02
- Granted: 2019-04-02
- Earliest claimed: 2013-10-01
- Assignees: Globalfoundries Inc.
- Applicants: GlobalFoundries Inc.
- Inventors: Stephen P. Ayotte; Glen E. Richard; Timothy D. Sullivan; Timothy M. Sullivan
- Web page: https://patentgrep.com/patent/US10245667B2

## CPC

- B23K 1/002: Soldering by means of induction heating
- B23K 1/0016: {Soldering of electronic components}
- H05K 3/3494: Heating processes for reflow soldering
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 2203/101: Using electrical induction, e.g. for heating during soldering
- Y10T 29/49144: by metal fusion
- Y10T 29/53178: Chip component
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

## Claims

### Claim 1

An apparatus for joining a chip with a substrate, the apparatus comprising:
a pick-and-place machine including a pick-up head to for releasably holding the chip and a robotic arm for moving the pick-up head in a motion path;
an induction heater including a plurality of coil turns located in the motion path directly over the substrate, the coil turns having an inner diameter defining an interior surface; and
a power supply coupled with the induction heater, the power supply configured to supply electrical power with a time-varying alternating current to the coil turns of the induction heater for heating solder bumps on the chip by electromagnetic induction while the chip is releasably held by the pick-up head, wherein the pick-up head moves the chip axially through the interior surface of the coil turns and toward the substrate.

### Claim 2 (depends on 1)

The apparatus of claim 1 wherein the pick-and-place machine continuously moves the pick-up head in the motion path toward the substrate as the induction heater heats the solder bumps.

### Claim 3 (depends on 1)

The apparatus of claim 1 further comprising: a controller coupled with the power supply, the controller including at least one processor and a memory including program code that, when executed by the at least one processor, causes the power supply to supply the electrical power with the time-varying alternating current to the coil turns of the induction heater.

### Claim 4 (depends on 3)

The apparatus of claim 3 wherein the controller is coupled with the pick-and-place machine, and the program code, when executed by the at least one processor, cause the robotic arm to move the pick-up head in the motion path in which the chip is moved axially through the interior surface of the coil turns.

### Claim 5 (depends on 4)

The apparatus of claim 4 further comprising: a conveyor, wherein the controller is coupled with the conveyor, and the program code, when executed by the at least one processor, cause the conveyor to move the substrate to a location at which the coils turns are directly over the substrate.

### Claim 6 (depends on 1)

The apparatus of claim 1 further comprising:
a conveyor for moving the substrate into a location proximate to the induction heater.

### Claim 7 (depends on 1)

The apparatus of claim 1 wherein the robotic arm is a programmable mechanical arm with a plurality of joints and a plurality of links connected by the joints that allow rotational motion and/or translational displacement of the pick-up head.

### Claim 8 (depends on 1)

The apparatus of claim 1 wherein the induction heater has a fixed position in relation to the substrate as the pick-up head moves in the motion path.