# US 10,245,661 B2 · Wire guide roll for wire saw and method

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- Number: US 10,245,661 B2
- Document ID: US10245661B2
- Status: Granted
- Kind: B2
- Application number: 12/106,428
- Filed: 2008-04-21
- Published: 2008-10-30
- Granted: 2019-04-02
- Earliest claimed: 2007-04-25
- Assignees: Siltronic AG
- Applicants: Anton Huber; Engelbert Auer; Manfred Schoenhofer; Helmut Seehofer; Peter Wiesner
- Inventors: Anton Huber; Engelbert Auer; Manfred Schoenhofer; Helmut Seehofer; Peter Wiesner
- Web page: https://patentgrep.com/patent/US10245661B2

## CPC

- B23D 57/0053: {of drives for saw wires; of wheel mountings; of wheels}
- B23D 61/18: Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions {(cut-off wheels of bonded abrasive or with inserted abrasive blocks B24D5/12)}
- B24B 27/0633: {using a cutting wire}
- B28D 5/045: {by cutting with wires or closed-loop blades (B28D5/042 takes precedence)}
- B65H 57/14: Pulleys, rollers, or rotary bars
- Y10T 83/9292: Wire tool
- B23D: PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR (making toothed gears or the like B23F; cutting metal by applying heat locally B23K; arrangements for copying or controlling B23Q)
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B28D: WORKING STONE OR STONE-LIKE MATERIALS
- B65H: HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.

## Claims

### Claim 1

A wire guide roll for guiding a sawing wire in a wire saw for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece, the wire guide roll provided with a coating having a thickness of at least 2 mm and at most 7.5 mm, the coating comprising a coating material which has a Shore A hardness of at least 60 and at most 99, the coating furthermore containing a multiplicity of annular grooves adapted to guide the sawing wire in a direction perpendicular to a longitudinal axis of the wire guide roll, wherein the grooves each have a curved groove base and an aperture angle a of 60-130°, the wire guide roll suitable for guiding a multiplicity of wire segments which constitute a wire gang of the wire saw.

### Claim 2

In a coated wire guide roll suitable for guiding a single sawing wire having a sawing wire diameter D in a wire saw and forming a wire gang capable of simultaneously slicing a multiplicity of wafers from a cylindrical semiconductor workpiece, the improvement comprising: providing the wire guide roll with a coating having a thickness of at least 2 mm and at most 7.5 mm, the coating comprising a coating material which has a Shore A hardness of at least 60 and at most 99, the coating furthermore containing a multiplicity of annular grooves adapted to guide the sawing wire having the sawing wire diameter D in a direction perpendicular to a longitudinal axis of the wire guide roll of the wire saw, wherein the grooves each have a curved groove base with a radius of curvature R which is 0.25-1.6 times the sawing wire diameter D, and an aperture angle a of 60-130°, the wire guide roll suitable for guiding a multiplicity of wire segments which constitute the wire gang of the wire saw.

### Claim 3 (depends on 2)

The wire guide roll of claim 2, wherein the coating of the wire guide roll consists of a material with a Shore A hardness of between 82 and 99.

### Claim 4 (depends on 3)

The wire guide roll of claim 3, wherein the radius of curvature R of the groove base is 0.4-0.9 times the sawing wire diameter D.

### Claim 5 (depends on 4)

The wire guide roll of claim 4, wherein the aperture angle of the grooves is 80-110°.

### Claim 6 (depends on 5)

A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 5 and slicing said cylindrical workpiece by said wire saw.

### Claim 7 (depends on 4)

The wire guide roll of claim 4, wherein polyurethane is used as the coating material.

### Claim 8 (depends on 3)

The wire guide roll of claim 3, wherein the aperture angle of the grooves is 80-110°.

### Claim 9 (depends on 3)

The wire guide roll of claim 3, wherein polyurethane is used as the coating material.

### Claim 10 (depends on 3)

A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 3 and slicing said cylindrical workpiece by said wire saw.

### Claim 11 (depends on 2)

The wire guide roll of claim 2, wherein the radius of curvature R of the groove base is 0.4-0.9 times the sawing wire diameter D.

### Claim 12 (depends on 11)

The wire guide roll of claim 11, wherein the aperture angle of the grooves is 80-110°.

### Claim 13 (depends on 11)

The wire guide roll of claim 11, wherein polyurethane is used as the coating material.

### Claim 14 (depends on 11)

A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 11 and slicing said cylindrical workpiece by said wire saw.

### Claim 15 (depends on 2)

The wire guide roll of claim 2, wherein the aperture angle of the grooves is 80-110°.

### Claim 16 (depends on 15)

The wire guide roll of claim 15, wherein polyurethane is used as the coating material, and the coating material thickness is from 2 mm to 6 mm.

### Claim 17 (depends on 15)

A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 15 and slicing said cylindrical workpiece by said wire saw.

### Claim 18 (depends on 2)

The wire guide roll of claim 2, wherein polyurethane is used as the coating material.

### Claim 19 (depends on 2)

A method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece by sawing with a sawing wire of a diameter D in a wire saw having wire guide rolls, comprising employing at least one wire guide roll of claim 2 and slicing said cylindrical workpiece by said wire saw.

### Claim 20 (depends on 2)

The wire guide roll of claim 2, wherein the multiplicity of annular grooves is such so as to accommodate about 300 turns of sawing wire.

### Claim 21 (depends on 2)

The wire guide roll of claim 2, wherein the cylindrical workpiece comprises a semiconductor single crystal.