# US 10,245,641 B2 · Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,245,641 B2 - Document ID: US10245641B2 - Status: Granted - Kind: B2 - Application number: 15/261,553 - Filed: 2016-09-09 - Published: 2016-12-29 - Granted: 2019-04-02 - Earliest claimed: 2012-02-03 - Assignees: ASML Netherlands B.V. - Applicants: Asml Netherlands B.V. - Inventors: Raymond Wilhelmus Louis Lafarre; Sjoerd Nicolaas Lambertus Donders; Nicolaas Ten Kate; Nina Vladimirovna Dziomkina; Yogesh Pramod Karade; Elisabeth Corinne Rodenburg - Web page: https://patentgrep.com/patent/US10245641B2 ## CPC - G03F 7/70341: {Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply (chemical composition of immersion liquids G03F7/2041)} - B05D 3/06: by exposure to radiation (B05D3/02 takes precedence {; plasma treatment B05D3/141}) - B05D 5/00: Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures - B22F 7/062: {involving the connection or repairing of preformed parts} - B22F 10/00: Additive manufacturing of workpieces or articles from metallic powder (apparatus or devices therefor B22F12/00) - B22F 10/20: Direct sintering or melting - B23K 26/342: Build-up welding - B23K 26/354: by melting - B23Q 3/18: for positioning only - B33Y 10/00: Processes of additive manufacturing - B33Y 80/00: Products made by additive manufacturing - G03F 7/20: Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) - G03F 7/70416: {2.5D lithography} - G03F 7/707: {Chucks, e.g. chucking or un-chucking operations or structural details} - G03F 7/70708: {being electrostatic; Electrostatically deformable vacuum chucks} - G03F 7/70716: {Stages} - G03F 7/70733: {Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask} - G03F 7/708: {Construction of apparatus, e.g. environment aspects, hygiene aspects or materials} - B22F 10/25: Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS] - B22F 10/28: Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] - B22F 10/66: by mechanical means - Y02P 10/25: Process efficiency - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02) - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B23Q: DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING (tools of the kind used in lathes or boring machines B23B27/00); MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack. ## Claims ### Claim 1 A substrate holder for use in a lithographic apparatus, the substrate holder comprising: a main body; and a plurality of burls provided on the main body and having end surfaces to support a substrate, wherein the burls each comprise a lower portion protruding from the main body and an upper body portion above the lower body portion, wherein the lower body portions are a different material than the upper body portions, the upper body portions comprise diamond-like carbon, and the upper portions are separated from each other such that they are unconnected by diamond-like carbon to each other. ### Claim 2 (depends on 1) The substrate holder according to claim 1, wherein the main body is formed of a different material than the burls. ### Claim 3 A substrate holder for use in a lithographic apparatus, the substrate holder comprising: a main body; and a plurality of projections protruding from the main body, wherein each of the projections comprise a first portion and a second portion, wherein the first portions are of a different material than the second portions, the second portions comprise diamond-like carbon, the second portions are separated from each other by an open gap between them, the first portions are separated from each other by an open gap between them, and the second portions are outward, relative to the main body, from the first portions. ### Claim 4 (depends on 3) A lithographic apparatus, comprising: a support structure configured to support a patterning device; a projection system arranged to project a beam patterned by the patterning device onto a substrate; and a substrate holder arranged to hold the substrate, the substrate holder being according to claim 3. ### Claim 5 A method of manufacturing a substrate holder for use in a lithographic apparatus, the method comprising: providing a main body; forming a plurality of burls protruding from the main body, the forming comprising: forming a lower body portion, protruding from the main body, of each of the burls, and forming, on each lower body portion, an upper body portion above the respective lower body portion, wherein the lower body portions are a different material than the upper body portions, the upper body portions comprise diamond-like carbon, and the upper portions are separated from each other such that they are unconnected by diamond-like carbon to each other. ### Claim 6 (depends on 1) The substrate holder according to claim 1, wherein the main body comprises at least one material selected from the group consisting of: Zerodur ceramic, cordierite, SiSiC, SiC, AIN, SiSiC, ceramic and glass-ceramic. ### Claim 7 (depends on 1) The substrate holder according to claim 1, wherein the burls project from the main body by a distance selected from the range of from 1 to 250 μm. ### Claim 8 (depends on 1) The substrate holder according to claim 1, wherein the burls are cylindrical. ### Claim 9 (depends on 1) The substrate holder according to claim 1, wherein the lower body portion comprises at least one material selected from the group consisting of: SiC, SiO2, TiN and CrN. ### Claim 10 (depends on 1) The substrate holder according to claim 1, further comprising a thin-film stack forming an electric or electronic component, the thin-film stack located at an upper surface of the main body. ### Claim 11 (depends on 10) The substrate holder according to claim 10, wherein the component is a component selected from the group consisting of: an electrode, a heater, a sensor, a transistor and a logic device. ### Claim 12 (depends on 1) A lithographic apparatus, comprising: a support structure configured to support a patterning device; a projection system arranged to project a beam patterned by the patterning device onto a substrate; and a substrate holder arranged to hold the substrate, the substrate holder being according to claim 1. ### Claim 13 (depends on 3) The substrate holder according to claim 3, wherein the projections project from the main body by a distance selected from the range of from 1 to 250 μm. ### Claim 14 (depends on 3) The substrate holder according to claim 3, wherein the projections are cylindrical. ### Claim 15 (depends on 3) The substrate holder according to claim 3, wherein the first portions comprise at least one material selected from the group consisting of: SiC, SiO2, TiN and CrN. ### Claim 16 (depends on 3) The substrate holder according to claim 3, further comprising a thin-film stack forming an electric or electronic component, the thin-film stack located at a surface of the main body. ### Claim 17 (depends on 16) The substrate holder according to claim 16, wherein the component is a component selected from the group consisting of: an electrode, a heater, a sensor, a transistor and a logic device. ### Claim 18 (depends on 5) The method according to claim 5, wherein the lower body portion comprises at least one material selected from the group consisting of: SiC, SiO2, TiN and CrN. ### Claim 19 (depends on 5) The method according to claim 5, further comprising forming a thin-film stack that forms an electric or electronic component, at an upper surface of the main body. ### Claim 20 (depends on 5) The method according to claim 5, wherein the burls project from the main body by a distance selected from the range of from 1 to 250 μm.