Polishing or grinding pad assembly

A pad assembly comprising:

• (a) a flexible pad including a floor-facing lower surface;
• (b) a reinforcement layer attached to the floor-facing lower surface of the pad, the reinforcement layer including an internal edge defining a hole therethough;
• (c) abrasive tools attached to a floor-facing surface of the reinforcement layer;
• and
• (d) a central area of the pad being exposed through the hole of the reinforcement layer such that a linear dimension of the central area within the hole is greater than an adjacent width dimension of one side of the reinforcement layer, and the central area of the pad being located at a rotational centerline of the pad and the reinforcement layer.

A pad assembly comprising:

• (a) a flexible pad including a floor-facing surface and an exposed circular peripheral surface;
• (b) a reinforcement ring attached to the floor-facing surface of the pad, the reinforcement ring including a circular periphery, the reinforcement ring being thinner than the pad with a ring-to-pad thickness ratio no greater than 0.125 to 1.0, and the reinforcement ring being flexible but stiffer than the pad;
• (c) at least three abrasive tools attached to a floor-facing surface of the reinforcement ring, and the abrasive tools being spaced apart from each other;
• (d) the pad assembly being a machine-rotatable floor polishing or grinding pad assembly adapted for use with a liquid or paste polishing or grinding material;
• and
• (e) a section of the pad being contactable with a floor through a hole in the reinforcement ring when polishing or grinding the floor.

A pad assembly comprising:

• (a) a flexible pad including a floor-facing surface;
• (b) a flexible layer attached to the floor-facing surface of the pad by an adhesive, the layer including a central hole through which a floor-abrading central area of the pad is exposed, the layer being thinner and stiffer than the pad, and the layer being a different material than the pad;
• (c) multiple floor-polishing or floor-grinding tools being spaced apart from each other and attached to a floor-facing surface of the layer;
• (d) diamond particles located on at least one of:
• (i) the pad or (ii) at least one of the tools;
• and
• (e) mechanical fasteners coupled to a top surface of the central area of the pad, adapted for removable attachment of the pad to a rotating floor polishing or grinding machine.