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US 10,244,668 B2Granted
Heat dissipating structure and electronic apparatus
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYoshihide Nakanishi, Norihiro Yahata, Hisashi Serita, Masaya Koshimuta
Life of this patent
Estimating the term…
Abstract
A heat radiation structure includes a heat spreader provided on a heating component mounted on a substrate, a heat sink disposed at a position facing the heat spreader, a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink, and a conductive member electrically connecting the heat spreader and the heat sink.
Claims8
A heat radiation structure comprising:
- a heat spreader provided on a heating component mounted on a substrate;
- a heat sink disposed at a position facing the heat spreader;
- a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink;
- and
- a conductive member electrically connecting the heat spreader and the heat sink, wherein:
- the conductive member is a conductive tape contacting each of the heat spreader and the heat sink,
- one end portion of the conductive tape is pinched between the heat spreader and the heat transfer member, and
- an other end portion of the conductive tape contacts an area on a back face of the heat sink, at which the heat transfer member is not disposed.
5 more elements
A heat radiation structure comprising:
- a heat spreader provided on a heating component mounted on a substrate;
- a heat sink disposed at a position facing the heat spreader;
- a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink;
- and
- a conductive member electrically connecting the heat spreader and the heat sink, wherein:
- the conductive member is a conductive tape contacting each of the heat spreader and the heat sink, and
- the conductive tape is wrapped around the heat transfer member so as to pass between the heat spreader and the heat transfer member and between the heat sink and the heat transfer member.
4 more elements
An electronic device comprising:
- a substrate;
- a heating component mounted on the substrate, and including a heat spreader;
- a heat sink disposed at a position facing the heat spreader;
- a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink;
- and
- a conductive member electrically connecting the heat spreader and the heat sink, wherein:
- the conductive member is a conductive tape contacting each of the heat spreader and the heat sink,
- one end portion of the conductive tape is pinched between the heat spreader and the heat transfer member, and
- an other end portion of the conductive tape contacts an area on a back face of the heat sink, at which the heat transfer member is not disposed.
6 more elements
An electronic device comprising:
- a substrate;
- a heating component mounted on the substrate, and including a heat spreader;
- a heat sink disposed at a position facing the heat spreader;
- a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink;
- and
- a conductive member electrically connecting the heat spreader and the heat sink, wherein:
- the conductive member is a conductive tape contacting each of the heat spreader and the heat sink, and
- the conductive tape is wrapped around the heat transfer member so as to pass between the heat spreader and the heat transfer member and between the heat sink and the heat transfer member.
5 more elements
Dependencies are inferred from the claim text.