US 10,242,305 B2 · Carrier tape, method for manufacturing same, and method for manufacturing RFID tag

Abstract

A method for manufacturing a carrier tape housing electronic components with seal materials includes preparing a tape-shaped main body with housing holes including bottom surfaces along a longitudinal direction, providing chip-shaped electronic components respectively into the housing holes, affixing a tape-shaped seal material having an adhesive layer on one principal surface to the tape-shaped main body such that the adhesive layer covers the housing holes and adheres to the electronic components, and forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions.

Claims10

Dependent claims

A method for manufacturing an RFID tag comprising the steps of:

preparing a carrier tape including a plurality of RFIC elements with seal materials, the RFIC elements with seal materials including a tape-shaped main body, a plurality of chip-shaped RFIC elements, and a plurality of seal materials affixed to the tape-shaped main body such that each of the RFIC elements is covered by an adhesive layer provided on one principal surface of the seal material;
folding the tape-shaped main body to separate each of the RFIC elements with seal materials from the tape-shaped main body;
and
continuously affixing the separated RFIC element with a seal material to an antenna base material with a plurality of antenna elements.

1 more element

An apparatus for manufacturing an RFID tag comprising:

a carrier tape including a plurality of RFIC elements with seal materials, the RFIC elements with seal materials including a tape-shaped main body, a plurality of chip-shaped RFIC elements, and a plurality of seal materials affixed to the tape-shaped main body such that each of the RFIC elements is covered by an adhesive layer provided on one principal surface of the seal material;
a separation mechanism folding the tape-shaped main body to separate each of the RFIC elements with seal materials from the tape-shaped main body;
and
an affixing mechanism continuously affixing the separated RFIC element with a seal material to an antenna base material with a plurality of antenna elements.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

15/849,963Filed 21 Dec 2017 · continuation

Priority

JP 2015-12305118 Jun 2015

Published

US 2018/0114105 A126 Apr 2018

Granted

26 Mar 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

G06K 19/07749
Constructional details, e.g. mounting of circuits in the carrier: the record carrier being capable of non-contact communication, e.g.…
G06K 19/0715
At least one of the integrated circuit chips comprising an arrangement for power management: the arrangement including means to regulate power…
G06K 19/077
With integrated circuit chips: constructional details, e.g. mounting of circuits in the carrier
G06K 19/07722
Physical layout of the record carrier: the record carrier being multilayered, e.g. laminated sheets

Family

PCT/JP2016/064370Parent of this continuation · filed 13 May 2016

Application15/281,701Parent of this continuation · filed 30 Sep 2016

US 2018/0114105 A1Pre-grant publication · published 26 Apr 2018

US 9,911,079 B2Parent of this continuation

US 2017/0017872 A1Published application

US 10,242,305 B2This patent

From the US filing history. Foreign family members aren’t listed.

Carrier tape, method for manufacturing same, and method for manufacturing RFID tag

Life of this patent

Carrier tape, method for manufacturing same, and method for manufacturing RFID tag

Life of this patent

Abstract

Claims10