Fingerprint sensor having printed circuit board and method of manufacture
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWoon-Chun Kim, Ga-Young Yoo, Hyung-Mi Jung, Hyun-Chul Jung, Jeong-Bok Kwak, Ji-Hye Shim
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Abstract
A fingerprint sensor includes a first conductive pattern formed on one side of a core, a second conductive pattern formed on the first conductive pattern, an insulating layer formed between the first conductive pattern and the second conductive pattern, a dielectric layer configured to cover the second conductive pattern, and a protective layer covering the dielectric layer, wherein the protective layer includes a photosetting resin.
Claims6
A method of manufacturing a fingerprint sensor, comprising:
- forming a first conductive pattern, a third conductive pattern, and a via on a core;
- forming an insulating layer on the first conductive pattern;
- forming a second conductive pattern on the insulating layer;
- forming a dielectric layer on the second conductive pattern such that a first surface of the dielectric layer is disposed on the second conductive pattern;
- forming a protective layer on a second surface of the dielectric layer opposite the first surface of the dielectric layer;
- and
- forming a solder resist layer on the third conductive pattern,
- wherein the forming of the solder resist layer on the third conductive pattern comprises coating a solder resist material on the third conductive pattern and exposing the solder resist material to light,
- wherein the forming of the protective layer on the second surface of the dielectric layer opposite the first surface of the dielectric layer comprises forming a photosetting material on the dielectric film, and exposing the photosetting material to light, and
- wherein the forming of the dielectric layer on the second conductive pattern comprises forming a dielectric film in B-stage on the second conductive pattern, and heat-curing the dielectric film after the exposing of the photosetting material to light.
A method of manufacturing a fingerprint sensor, comprising:
- forming a first conductive pattern on a first surface of a core;
- forming an insulating layer on the first conductive pattern;
- forming a second conductive pattern on the insulating layer;
- forming a dielectric film on the second conductive pattern such that a first surface of the dielectric film is disposed on the second conductive pattern;
- forming a third conductive pattern on a second surface of the core;
- forming a solder resist layer on the third conductive pattern by disposing a solder resist film on the third conductive pattern and photo-curing the solder resist film;
- forming a protective layer on the dielectric film by disposing a photosetting film on a second surface of the dielectric film opposite the first surface of the dielectric film, and photo-curing the photosetting film;
- and
- heat-curing the dielectric film after the forming of the protective layer.
Dependencies are inferred from the claim text.