Semiconductor fingerprint identification sensor and manufacturing method thereof

A method for manufacturing a semiconductor fingerprint identification sensor, comprising:

• cutting a flexible substrate;
• drilling a through hole on the flexible substrate, and forming a metal layer on a surface of the flexible substrate, such that an electrically conductive via hole is formed by metalizing the through hole;
• forming a photosensitive film layer on the metal layer, and forming a sensing lead circuit of a wiring layer by a pattern process;
• coating an insulation layer on the sensing lead circuit;
• electroplating a sensor array, an integrated circuit bonding pad and an interface contact on a surface of the flexible substrate away from the wiring layer to form a sensing area, a control area and an interface area respectively;
• and
• forming a protective layer on a top surface of the flexible substrate,
• wherein the wiring layer and the insulation layer are formed on an opposite side of the flexible substrate away from the sensor array,
• wherein a fingerprint information sensed in the sensing area is sent to the control area through the electrically conductive via hole and the sensing lead circuit of the wiring layer, and
• wherein a fingerprint identification sensor integrated circuit is welded in the control area and formed on same side of the flexible substrate as the sensor array, the fingerprint identification sensor integrated circuit is configured to identify and process the fingerprint information sensed in the sensing area so as to form a fingerprint image.

A semiconductor fingerprint identification sensor, comprising:

• a sensing area, a control area and an interface area;
• wherein the sensing area and the control area are in communication with each other, and
• a fingerprint information sensed in the sensing area is sent to the control area,
• wherein the sensing area comprises an insulation layer, an wiring layer, a substrate layer and a protective layer which are stacked in a sequence, the wiring layer is embedded between the insulation layer and the substrate layer, a sensor array is disposed on a side of the substrate layer being in contact with the protective layer, a via hole which corresponds to the sensor array is disposed on the substrate layer, the sensor array is electrically connected with a sensing lead circuit of the wiring layer through the via hole;
• wherein the via hole is located beneath the sensor array,
• wherein the wiring layer and the insulation layer are disposed on an opposite side of the substrate layer away from the sensor array,
• wherein the fingerprint information sensed in the sensing area is sent to the control area through the via hole and a sensing lead circuit of the wiring layer, and
• wherein the control area comprises a fingerprint identification sensor integrated circuit welded in the control area and disposed on same side of the substrate layer as the sensor array, the fingerprint identification sensor integrated circuit is configured to identify and process the fingerprint information sensed in the sensing area so as to form a fingerprint image.