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US 10,242,143 B2Granted
Radio frequency isolation structure with racetrack
AssigneeSkyworks Solutions, Inc.
InventorsHoward E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
Life of this patent
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Abstract
Aspects of the present disclosure relate to a racetrack that forms part of an RF isolation structure of a packaged module and wireless devices that include such a packaged module. The racetrack can be disposed in a substrate and around an RF component that is on the substrate. The racetrack can include at least one break and/or at least one narrowed section without significantly degrading the EMI performance of the RF isolation structure.
Claims20
A wireless device comprising:
- an antenna configured to facilitate at least one of transmitting or receiving a radio-frequency signal;
- a packaged module in communication with the antenna, the packaged module including a substrate configured to receive a plurality of components;
- a radio frequency component coupled to a major surface of the substrate;
- a racetrack in the substrate, the racetrack configured at a ground potential, the racetrack including a continuous portion along a periphery of the packaged module, the continuous portion including a first part and a second part that extends in a direction substantially orthogonal to the first part, and the racetrack having a narrowed section that has a width that is narrower than other portions of the racetrack, the narrowed section of the racetrack being located in a low radiating area that is associated with less electromagnetic radiation than the other portions of the racetrack;
- a conductive layer electrically connected to the racetrack such that the racetrack and the conductive layer form at least a portion of a radio frequency isolation structure around the radio frequency component, the radio frequency component being positioned between the major surface of the substrate and the conductive layer;
- a wirebond pad and a wirebond in contact with the conductive layer and the wirebond pad;
- and a via in the substrate, the via being disposed between the racetrack and the major surface, and the via being in an electrical path between the racetrack and the wirebond pad;
- and
- an other electronic module in communication with the packaged module.
6 more elements
A packaged module comprising:
- a radio frequency component coupled to a major surface of a substrate;
- a racetrack in the substrate, the racetrack configured at a ground potential, and the racetrack having a section that has a break or a width that is narrower than other portions of the racetrack, the section that has the break or width that is narrower being located in a low radiating area that is associated with less electromagnetic radiation than the other portions of the racetrack;
- a wirebond pad bonded to a wirebond;
- a via in the substrate, the via being positioned between the racetrack and the wirebond pad, and the via being in an electrical path between the racetrack and the wirebond pad;
- and
- a conductive layer electrically connected to the wirebond pad by the wirebond such that the racetrack, the wirebond, the via, and the conductive layer form at least a portion of a radio frequency isolation structure around the radio frequency component, the radio frequency component being positioned between the major surface of the substrate and the conductive layer.
3 more elements
A packaged module comprising:
- a radio frequency component coupled to a major surface of a substrate;
- a racetrack in the substrate, the racetrack configured at a ground potential, the racetrack including a continuous portion along a periphery of the packaged module, the continuous portion including a first part and a second part that extends in a direction substantially orthogonal to the first part, the racetrack having a narrowed section that has a width that is narrower than other portions of the racetrack, and the narrowed section of the racetrack being located in a low radiating area that is associated with less electromagnetic radiation than the other portions of the racetrack;
- a conductive layer electrically connected to the racetrack such that the racetrack and the conductive layer form at least a portion of a radio frequency isolation structure around the radio frequency component, the radio frequency component being positioned between the major surface of the substrate and the conductive layer;
- a wirebond pad and a wirebond in contact with the conductive layer and the wirebond pad;
- and
- a via in the substrate, the via being disposed between the racetrack and the major surface, and the via being in an electrical path between the racetrack and the wirebond pad.
3 more elements
Dependencies are inferred from the claim text.