US 10,241,844 B2 · Techniques for heat spreading in an integrated circuit

Abstract

First and second circuits in an integrated circuit that generate local hot spots are activated at different times in order to reduce heat generation within each of the first and second circuits. The first and second circuits in the integrated circuit have the same circuit architecture. The first circuit processes data during a first time period, and heat generation is reduced in the second circuit during the first time period. A data path of the data is then switched from the first circuit to the second circuit. The second circuit then processes the data during a second time period after the first time period, and heat generation is reduced in the first circuit during the second time period. The data path of the data is then switched from the second circuit back to the first circuit. The first circuit then processes the data again.

Claims20

Dependent claims

An integrated circuit comprising:

a transceiver circuit, wherein the transceiver circuit comprises a first lane comprising a first processing circuit for processing first data indicated by a first data signal that is received at the first lane during normal operation, and wherein the transceiver circuit further comprises a second lane comprising a second processing circuit for processing second data indicated by a second data signal that is received at the second lane during the normal operation;
and
a control circuit that causes the first data indicated by the first data signal to be dynamically switched between the first and second processing circuits during alternating periods of time during a dynamic switching mode, wherein the first and second processing circuits alternate between processing the first data indicated by the first data signal during the alternating periods of time during the dynamic switching mode to reduce heat generation within the first and second lanes.

A method for reducing hot spots in circuits, the method comprising:

processing data using a first circuit during a first time period;
reducing heat generation in a second circuit during the first time period, wherein the first circuit and the second circuit have the same circuit architecture;
switching a data path of the data from the first circuit to the second circuit;
processing the data using the second circuit during a second time period after the first time period;
reducing heat generation in the first circuit during the second time period;
switching the data path of the data from the second circuit to the first circuit;
and
processing the data using the first circuit during a third time period after the second time period.

5 more elements

Dependencies are inferred from the claim text.

Techniques for heat spreading in an integrated circuit

Life of this patent

Techniques for heat spreading in an integrated circuit

Life of this patent

Abstract

Claims20