Functional panel, functional module, light-emitting module, display module, location data input module, light-emitting device, lighting device, display device, data processing device, and manufacturing method of functional panel

A functional panel comprising:

• a terminal;
• a wiring electrically connected to the terminal;
• a first base comprising a region overlapping with the terminal and a region overlapping with the wiring;
• a second base comprising a region overlapping with the first base;
• a bonding layer between the first base and the second base;
• a release layer between the wiring and the bonding layer;
• and
• a functional layer between the first base and the bonding layer,
• wherein the functional layer comprises a functional element, and
• wherein the functional element is electrically connected to the wiring.

A manufacturing method of a functional panel, the manufacturing method comprising the steps of:

• preparing a first member and a second member, the first member comprising:
• a terminal,
• a wiring electrically connected to the terminal,
• a first base comprising a region overlapping with the terminal and a region overlapping with the wiring,
• a release layer comprising a region overlapping with the terminal, and
• a functional layer comprising a region overlapping with the first base and a functional element,
• wherein the functional element is electrically connected to the wiring, and
• the second member comprising:
• a substrate,
• a layer to be separated comprising a region overlapping with the substrate, and
• a separation layer between the substrate and the layer to be separated;
• bonding the first member and the second member using a bonding layer which is in contact with the release layer, with the functional layer, and with a region where the layer to be separated and the separation layer are not formed so that the release layer of the first member overlaps with the region where the layer to be separated and the separation layer is not formed;
• forming a separation starting point by detaching part of the layer to be separated from the substrate;
• detaching one part of the bonding layer and the layer to be separated from the other part of the bonding layer and the substrate;
• and
• bonding a second base to the layer to be separated using a resin layer.