Photosensitive resin composition, resist laminate, and cured product thereof (1)

A photosensitive resin composition comprising:

• an epoxy resin (A), a polyol compound (B), a cationic photopolymerization initiator (C), and an epoxy group-containing silane compound (D);
• wherein the epoxy resin (A) comprises an epoxy resin (a) obtained from reaction of a phenol derivative represented by the following Formula (1) and epihalohydrin:
• and an epoxy resin (b) represented by the following Formula (2):
• wherein m is an average value, representing a real number in the range from 4 to 6, R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, each X independently represents a hydrogen atom or a glycidyl group, and at least one of a plurality of X present is a glycidyl group;
• and
• the polyol compound (B) comprises a polyester polyol represented by the following Formula (3):
• wherein x is an average value, representing a real number in the range from 1 to 9, and R3 represents a divalent aliphatic hydrocarbon group which may comprise at least one ether bond within carbon chain of the hydrocarbon group;
• and/or a polyester polyol represented by the following Formula (4):
• wherein y is an average value, representing a real number in the range from 1 to 4, and R4 represents a trivalent aliphatic hydrocarbon group which may comprise at least one ether bond within carbon chain of the hydrocarbon group;
• wherein a blending ratio of the polyol compound (B) is 1 to 30 mass % relative to a mass of the epoxy resin (A);
• wherein a blending ratio of the cationic photopolymerization initiator (C) is 0.1 to 15 mass % to a total mass of the epoxy resin (A) and the polyol compound (B);
• wherein a blending ratio of the epoxy group-containing silane compound (D) is 1 to 15 mass % relative to a total mass of the epoxy resin (A), the polyol compound (B), and the cationic photopolymerization initiator (C);
• and
• wherein the ratio of the amount of the epoxy resin (b) to the amount of the epoxy resin (a) ranges from 10 to 70 mass %.