Photosensitive resin composition, production method for resin film, production method for organic semiconductor element, and fluorine-containing polymer

A photosensitive resin composition, comprising:

• a fluororesin having a polymerizable carbon-carbon double bond and having a fluorine atom content of at least 47 mass %;
• a crosslinking agent having a polymerizable carbon-carbon double bond, excluding the fluororesin;
• and
• a solvent composed of a fluorinated compound having no aromatic ring, which is liquid at 25° C.,
• wherein the fluororesin is composed of a copolymer having units of formula (u1) and units of formula (u21):
• wherein each of R1 and R2 is independently a hydrogen atom, a methyl group, an ethyl group or a halogen atom,
• each of X11, X12, X21 and X22 is independently a hydrogen atom or a halogen atom,
• each of Q1 and Q2 is independently a bivalent linking group,
• Rf1 is a C1-10 perfluoroalkyl group or a C2-10 perfluoroalkyl group having an etheric oxygen atom between carbon-carbon atoms,
• Rf2 is a C1-10 perfluoroalkylene group or a C2-10 perfluoroalkylene group having an etheric oxygen atom between carbon-carbon atoms, and
• Z1 is a monovalent organic group having a polymerizable carbon-carbon double bond.