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US 10,241,264 B2Granted
Semiconductor device packages
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYi-Min Chin, Yung-Shun Chang, Mei-Ju Lu, Jia-Hao Zhang, Wen-Chi Hung
Life of this patent
Estimating the term…
Abstract
A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.
Claims19
A semiconductor device package, comprising:
- a substrate having a first surface;
- a waveguide disposed in the substrate;
- and
- an optical device comprising:
- a first portion extending into the substrate and under the first surface of the substrate, the first portion comprising a vertical surface, the vertical surface comprising a light transmission area, wherein the light transmission area is smaller than the vertical surface and is aligned with the waveguide, and
- a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises at least two protrusions orthogonal to each other, and the substrate defines at least two grooves extending from the first surface of the substrate, and wherein the at least two protrusions of the second portion of the optical device engage with the at least two grooves of the substrate.
3 more elements
A semiconductor device package, comprising:
- a substrate having a first surface, the substrate defining a space having a bottom surface;
- a waveguide in the substrate;
- and
- an optical device disposed in the space and separated from the bottom surface of the space by a distance, the optical device comprising:
- an alignment portion extending along the first surface of the substrate and supported by the first surface of the substrate, and
- an optical portion comprising a vertical surface, the vertical surface comprising a light transmission area, wherein the light transmission area is smaller than the vertical surface and is aligned with the waveguide, wherein the alignment portion of the optical device comprises at least two protrusions orthogonal to each other, and the substrate defines at least two grooves extending from the first surface of the substrate, and wherein the at least two protrusions of the alignment portion of the optical device engage with the at least two grooves of the substrate.
3 more elements
A semiconductor device package, comprising:
- a substrate comprising a first surface;
- a waveguide disposed in the substrate;
- and
- an optical device comprising;
- a first portion extending into the substrate without protruding from the first surface of the substrate, the first portion comprising a vertical surface, the vertical surface comprising a light transmission area, wherein the light transmission area is smaller than the vertical surface and is aligned with the waveguide, and
- a second portion extending along the first surface of the substrate;
- wherein the second portion of the optical device is directly disposed on the first surface of the substrate, the second portion of the optical device comprises at least two protrusions orthogonal to each other, the substrate defines at least two grooves, and each protrusion of the second portion fits into a respective groove in the substrate.
4 more elements
Dependencies are inferred from the claim text.