Socket apparatus for semiconductor device test

A socket apparatus for a semiconductor device test, the socket apparatus comprising:

• body elements (100, 200) into which contacts (400) are fixedly inserted;
• movable elements (300, 500) on which a semiconductor device (IC) is seated such that leads of the semiconductor device come into contact with upper ends of the contacts (400), the movable elements (300, 500) being resiliently supported by the body elements (100, 200) so as to be movable up and down within a preset height range;
• a socket cover (600) assembled to upper portions of the movable elements (300, 500) and resiliently assembled to the body elements (100, 200) so as to be movable up and down;
• and
• a semiconductor device pressing part configured to press and fix the semiconductor device (IC) seated on the movable elements (300, 500),
• wherein the semiconductor device pressing part (700) includes:
• a latch of which a first end is hingedly coupled to the socket cover;
• a pusher plate (710) hingedly coupled to a second end of the latch such that the pusher plate is rotatable on the second end of the latch, wherein the pusher plate (710) is configured to contact with an upper surface of the semiconductor device (IC) and applies pressure thereto;
• and
• a link (730) of which a first end is hingedly assembled to the socket body (100) and a second end is hingedly coupled to a middle portion of the latch (720), and
• wherein the latch, the pusher plate and the link are separated from each other.

A socket apparatus for a semiconductor device test, the socket apparatus comprising:

• a socket body provided with a plurality of first receiving holes for receiving contacts therein;
• a lower plate provided in a lower portion of the socket body, the lower plate being provided with a plurality of second receiving holes that is formed through the lower plate and respectively communicates with the first receiving holes such that lower contact portions of the contacts come into electric contact with leads of a printed circuit board (PCB);
• a floating plate supported by a plurality of first elastic materials at an upper location of the socket body so as to be movable up and down, the floating plate having an upper surface serving as a seating surface to seat a semiconductor device thereon, and a plurality of through holes where upper contact portions of the contacts are held therein while passing through the floating plate;
• the plurality of contacts inserted into the first receiving holes and the second receiving holes such that the lower contact portions of the contacts come into contact with the leads of the PCB, and the upper contact portions of the contacts come into contact with leads of the semiconductor device through the through holes;
• an adaptor plate provided on an upper portion of the floating plate, the adaptor plate having a guide surface that guides the semiconductor device to be seated on the floating plate;
• a socket cover supported by a plurality of second elastic materials (S2) and assembled to the socket body by a plurality of hooks so as to be movable up and down on the socket body, the socket cover having an opening such that the semiconductor device is guided along the guide surface to be loaded on the floating plate, wherein an inner surface of the opening is provided with an opening protrusion formed by protruding therefrom;
• and
• a semiconductor pressing part pressing and fixing the semiconductor device seated on the floating plate, while the semiconductor pressing part is operated in conjunction with movement of the socket cover between upper and lower positions,
• wherein the semiconductor device pressing part includes:
• a pusher plate having an opening cam protruding from an end thereof to contact with the opening protrusion, wherein the pusher plate is configured to contact with an upper surface of the semiconductor device and applies pressure thereto;
• a latch of which a first end is hingedly assembled to the socket cover and a second end is hingedly assembled to the pusher plate;
• and
• a link of which a first end is hingedly assembled to the socket body and a second end is hingedly assembled to the latch, the link including
• two link plates positioned parallel to each other and having hinge holes at upper and lower ends so as to be assembled to the latch and the socket body respectively by hinge pins, and
• a fixing plate fixing the link plates to each other and having a fixing hole for fixing an end of a first torsion spring thereto.