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US 10,240,957 B2Granted
Thermal airflow sensor
AssigneeHitachi Automotive Systems, Ltd.
InventorsRyosuke Doi, Hiroshi Nakano, Keiji Hanzawa
Life of this patent
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Abstract
A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.
Claims2
A thermal airflow sensor comprising:
- a semiconductor device having a thin-wall portion on which a heating resistor and resistance temperature detectors are provided;
- a protective film formed on a surface of the semiconductor substrate so that the heating resistor is exposed;
- a bonding wire connected to the semiconductor device electrically;
- a resin that covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including the thin-wall portion is exposed;
- wherein the protective film has multiple slits between the region covered with the resin and the thin-wall portion.
2 more elements
Dependencies are inferred from the claim text.