Method for calibrating an annealing furnace used to form thermal donors
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsSébastien Dubois, Jordi Veirman
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AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsSébastien Dubois, Jordi Veirman
Estimating the term…
A method for calibrating a furnace enabling a semiconductor material to be subjected to a first thermal donor formation annealing that includes a temperature rise, a first temperature plateau and a temperature drop of the furnace, the method to including providing a calibration piece of the semiconductor material; determining the interstitial oxygen concentration of the piece; subjecting the piece to a second thermal donor formation annealing in the furnace, the second annealing including rise and drop in temperature of the furnace identical to those of the first annealing and a second plateau at the set temperature for a set time; determining the concentration of thermal donors formed in the piece during the second annealing; determining an equivalent annealing time at the set temperature, corresponding at least to the rise and drop in temperature of the furnace, from the interstitial oxygen concentration, the thermal donor concentration of the piece and the set time.
A method for calibrating a furnace by determining an equivalent annealing time corresponding at least to a rise and a drop in temperature of the furnace so as to take into account a formation of thermal donors during heating and cooling phases of the furnace when a sample of semiconductor material is subjected to a first annealing in said furnace, the first annealing successively comprising the rise in temperature of the furnace, a first plateau at a set temperature and the drop in temperature of the furnace, the method comprising:
Dependencies are inferred from the claim text.