Free access floor structure, and manufacturing apparatus and carrier apparatus adapted for floor structure

A semiconductor manufacturing apparatus comprising:

• a bottom plate,
• an apparatus-side connector provided to the bottom plate, and
• a first positioning target mechanism provided to the bottom plate, wherein
• the semiconductor manufacturing apparatus is configured so that the semiconductor manufacturing apparatus is mountable on a free access floor structure, which includes a floor plate, a floor-side connector provided to the floor plate and connectable to one of a gas supply pipe and an exhaust gas pipe, and a first positioning mechanism provided to the floor plate, through a lowering operation of the semiconductor manufacturing apparatus in which the semiconductor manufacturing apparatus is lowered integrally as one body together with the apparatus-side connector, toward the floor plate, with the floor plate installed on a floor surface, the floor-side connector facing upward, and the apparatus-side connector facing downward, and
• the apparatus-side connector is configured so that the apparatus-side connector and the floor-side connector complete a connection to each other through the lowering operation, and the first positioning target mechanism is configured to cooperate with the first positioning mechanism through the lowering operation to position the bottom plate with respect to the floor plate, to thereby mount the semiconductor manufacturing apparatus on the free access floor structure through the lowering operation with the semiconductor manufacturing apparatus being connectable to the one of a gas supply line and an exhaust gas pipe through the connected apparatus-side connector and the floor-side connector,
• so that the lowering operation thereby operates as a single operation to mount the semiconductor manufacturing apparatus on the free access floor structure and connect the apparatus-side connector and the floor-side connector to each other.

An apparatus comprising:

• a free access floor structure including
• a floor plate that is installable on a floor surface, and
• a floor-side connector that is connectable to one of a gas supply pipe and an exhaust gas pipe, and is provided to the floor plate so that, when the floor plate is installed on the floor surface, the floor-side connector faces upward, and
• a semiconductor manufacturing apparatus including
• a bottom plate, and
• an apparatus-side connector provided to the bottom plate,
• wherein
• the semiconductor manufacturing apparatus and the free access floor structure are configured so that the semiconductor manufacturing apparatus is mountable on the free access floor structure through a lowering operation of the semiconductor manufacturing apparatus in which the semiconductor manufacturing apparatus is lowered integrally as one body together with the apparatus-side connector, toward the floor plate, with the floor plate installed on a floor surface, the floor-side connector facing upward, and the apparatus-side connector facing downward, and
• the apparatus-side connector and the floor-side connector are configured so that the apparatus-side connector and the floor-side connector complete a connection to each other through the lowering operation, to thereby mount the semiconductor manufacturing apparatus on the free access floor structure through the lowering operation with the semiconductor manufacturing apparatus being connectable to the one of a gas supply line and an exhaust gas pipe through the connected apparatus-side connector and the floor-side connector,
• so that the lowering operation thereby operates as a single operation to mount the semiconductor manufacturing apparatus on the free access floor structure and connect the apparatus-side connector and the floor-side connector to each other.