Portable, liquid free, electroless, electrochemical deposition of metal on conductive and nonconductive surfaces
AssigneeOceanit Laboratories, Inc.
InventorsGanesh Kumar Arumugam, Ashavani Kumar, Vinod P. Veedu, Sumil Thapa
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Abstract
Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.
Claims21
Apparatus comprising a metal electrolyte assembly adapted for selectively depositing metal on a surface without any external stimuli, a substrate having the surface, the metal electrolyte assembly further comprising a solid electrolyte block having a metal salt and a polymer solution acting as a binder, wherein the solid electrolyte block is adapted for rubbing on the surface on which metal from the metal salt is to be deposited.
A method comprising forming a solid electrolyte block adapted for selectively depositing metal on a surface without any external stimuli, by mixing a metal salt with a polymer solution acting as a binder and forming the solid electrolyte block with the mixed metal salt and the binder, providing a substrate having the surface, wherein the solid electrolyte block is adapted for rubbing on the surface on which metal from the metal salt is to be deposited.
Dependencies are inferred from the claim text.