Bonding dissimilar materials with adhesive paste
AssigneeZephyros, Inc.
InventorsRenee Bradley, David Sheasley, Jeanne Bednarski
Life of this patent
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Abstract
A rivetable adhesive for use in a joint between dissimilar materials, comprising a liquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a phenoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures.
Claims19
A rivetable adhesive for use in a joint between dissimilar materials, comprising:
- a. a first liquid epoxy resin in an amount of about 15 to about 25 parts by weight per 100 parts by weight of the rivetable adhesive and a second liquid epoxy resin in amount of about 3 to about 20 parts by weight per 100 parts by weight of the rivetable adhesive;
- b. an expoxidized polysulfide;
- c. a flexibilizer;
- d. a solid epoxy CTBN adduct based upon bisphenol A in an amount not greater than about 15 parts by weight per 100 parts by weight of the rivetable adhesive;
- e. a phenoxy resin;
- f. an impact modifier including methacrylate-butadiene-styrene;
- g. a curing agent;
- and
- h. a blowing agent having a decomposition temperature of about 190 to about 220° C.;
- and
- wherein the adhesive exhibits a capillary viscosity of below 800 PaS for a shear rate of 100 sec−1 or higher at a temperature of 70 or 90° C.;
- wherein a ratio of the amount by weight of the first liquid epoxy resin to the amount by weight of the second liquid epoxy resin is from about 1.6:1 to about 2.4:1;
- and
- wherein the decomposition temperature of the blowing agent facilitates robotic application such that the adhesive is heated to be applied above room temperature, but below a temperature at which it would be activated for curing, expanding or both curing and expanding.
A rivetable adhesive for use in a joint between dissimilar materials, comprising an admixture of:
- a. a first liquid epoxy resin including a liquid epoxy resin reaction product of epichlorohydrin and bisphenol A and having an epoxide equivalent weight per ASTM D-1652-11e1 of about 182 to about 192;
- b. about 10 to about 20 parts by weight of an epoxidized polysulfide;
- c. a second liquid epoxy resin including a liquid epoxy resin reaction product of an epichlorohydrin and a polypropylene glycol;
- d. about 1 to about 5 parts by weight of a flexibilizer;
- e. about 3 to about 15 parts by weight of a solid epoxy carboxyl terminated butadiene-acrylontirile (CTBN) adduct based upon bisphenol A;
- f. a blowing agent having a decomposition temperature of about 190 to about 220° C.;
- and
- wherein the ratio of the amount by weight of the first liquid epoxy resin to the amount by weight of the second liquid epoxy resin in the adhesive is from about 1.6:1 to about 2.4:1;
- wherein the adhesive exhibits a capillary viscosity of below 800 PaS for a shear rate of 100 sec−1 or higher at a temperature of 70 or 90° C.;
- and
- wherein the decomposition temperature of the blowing agent facilitates robotic application such that the adhesive is heated to be applied above room temperature, but below a temperature at which it would be activated for curing, expanding or both curing and expanding.
Dependencies are inferred from the claim text.