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US 10,239,748 B2Granted
Microelectromechanical device with protection for bonding
AssigneeSTMicroelectronics S.r.l.
InventorsLuca Maggi, Sebastiano Conti
Life of this patent
Estimating the term…
Abstract
A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.
Claims16
A microelectromechanical device comprising:
- a substrate;
- a semiconductor die adhered to the substrate and incorporating a microstructure, the die including a supporting frame defining a cavity;
- a film adhesive layer between the supporting frame and the substrate;
- and
- a layer of porous material between the supporting frame and the film adhesive layer, the layer of porous material having a plurality of pores, the film adhesive layer adhering the die to the substrate through the plurality of pores of the layer of porous material, the cavity overlapping a portion of the film adhesive layer and a portion of the layer of porous material.
2 more elements
A microelectromechanical microphone comprising:
- a microelectromechanical device including:
- a first semiconductor die;
- a second semiconductor die having a first surface and a second surface opposite to the first surface, the first surface including a movable membrane, the second surface including a cavity, the second surface facing the first semiconductor die;
- a film adhesive layer between the second semiconductor die and the first semiconductor die, the film adhesive layer in physical contact with the first semiconductor die;
- and
- a protective layer between the second semiconductor die and the film adhesive layer, the protective layer including a plurality of apertures, the film adhesive layer extending through the apertures of the protective layer and physically contacting the second surface of the second semiconductor die to adhere the second semiconductor die to the first semiconductor die, the cavity directly overlying a portion of the film adhesive layer and a portion of the protective layer.
3 more elements
An electronic system comprising:
- a control unit;
- and
- a microelectromechanical device coupled to the control unit, the microelectromechanical device including:
- a first semiconductor die having a surface;
- a second semiconductor die including a support frame and a microstructure, the support frame forming a cavity, the microstructure overlying the cavity;
- a film adhesive layer adhering to the surface of the first semiconductor die;
- and
- a protective layer having a plurality of pores located between the support frame and the film adhesive layer,
- the film adhesive layer extending from a first side of the protective layer, through the plurality of pores of the protective layer, and to a second side, opposite to the first side, of the protective layer,
- the film adhesive adhering the support frame of the second semiconductor die to the first semiconductor die,
- the film adhesive layer and the protective layer extending across the cavity such that the microstructure overlies the film adhesive layer and the protective layer.
8 more elements
Dependencies are inferred from the claim text.