Method for embossing of substrates

A method for applying a structure material to a substrate and embossing the structure material on the substrate, the applying and embossing being performed in an embossing device, the embossing device having side walls, a base plate, and a cover that define a working space that is isolated from a surrounding environment, the method comprising:

• first calibrating and aligning the substrate with an application means of the embossing device, the first calibrating and aligning being performed within the embossing device by a calibrating means of the embossing device, the calibrating means being located at least partially in the working space of the embossing device,
• performing one or more applications of the structure material to the first calibrated and aligned substrate while the first calibrated and aligned substrate is in the working space, the applications being performed using the application means,
• second calibrating and aligning the first calibrated and aligned substrate with an embossing means of the embossing device, the embossing means being located at least partially in the working space of the embossing device, the second calibrating and aligning being performed within the embossing device by the calibrating means of the embossing device, the embossing means comprising an embossing die, one or more actuators that are individually position-controlled and/or force controlled, and one or more dynamometer cells respectively corresponding with the actuators, the dynamometer cells being configured to measure an embossing force applied by the actuators and/or respective positions of the actuators, and
• performing one or more embossings of the structure material on the second calibrated and aligned substrate while the second calibrated and aligned substrate is in the working space, the performing the embossings comprising:
• respectively operating the actuators to move the embossing die and apply the embossing force to the structure material and the second calibrated and aligned substrate via the embossing die;
• respectively operating the dynamometer cells to measure the embossing force applied to the structure material by the actuators acting on the embossing die and/or the respective positions of the actuators,
• wherein the working space has a defined atmosphere, before and during performing of the one or more embossings, without interruption,
• wherein the application means includes at least one nozzle disposed in the working space and an actuator for moving the at least one nozzle in a direction perpendicular to the substrate, and
• wherein an actuator rod of the actuator extends through the cover of the device.