Carrying method and bonding apparatus

A carrying method comprising:

• a support carrying-in stage of carrying a support having an adhesive layer formed on a surface on a lower side thereof in an overlapping chamber;
• a support transferring stage of supporting from below and upwardly moving the support carried in the overlapping chamber by a supporting pin that can move in a vertical direction, and transferring the support to a holding member for holding the support;
• a substrate carrying-in stage of carrying a substrate in the overlapping chamber after the support transferring stage;
• a heating stage of supporting and downwardly moving the substrate by the supporting pin, and heating the substrate by a heating portion provided on a lower portion of the overlapping chamber;
• an overlapping stage of overlapping the substrate and the support after the heating stage;
• a first carrying step of carrying the substrate and the support which are overlapped from the overlapping chamber in which overlapping between the substrate and the support is performed to a bonding chamber in which bonding between the substrate and the support is performed by a first robot arm;
• a second carrying step of carrying a bonded laminate from the bonding chamber to the overlapping chamber by the first robot arm;
• a transferring step of directly transferring the laminate carried by the first robot arm to the overlapping chamber, the overlapping chamber including the supporting pin, from the first robot arm to a second robot arm;
• and
• a carrying-out step of carrying-out the laminate transferred to the second robot arm, from the overlapping chamber to the outside.