Chemical mechanical polishing pad and method for manufacturing the same
AssigneeSlh Technology Co., Ltd.
InventorsChien-Hung Sung, Kuan-Ting Lin
Life of this patent
Estimating the term…
Abstract
A chemical mechanical polishing pad includes a base portion and a polishing portion. The base portion has opposite first and second side surfaces. The polishing portion extends from the first side surface away from the second side surface, has a polishing surface facing away from the base portion, and has at least one trench formed in the polishing surface. Each of the trenches has an opening defined by the polishing surface. A horizontal width of the opening of each of the trenches is equal to or smaller than that of the remaining portion of the trench. The chemical mechanical polishing pad is made by laminating a plurality of polymer layers.
Claims6
A chemical mechanical polishing pad comprising:
- a base portion that has opposite first and second side surfaces;
- a polishing portion that extends from said first side surface of said base portion away from said second side surface, that has a polishing surface facing away from said base portion, and that has a plurality of trenches formed in said polishing surface, each of said trenches having an opening defined by said polishing surface of said polishing portion, a horizontal width of said opening of each of said trenches being equal to or smaller than that of the remaining portion of said trench;
- and
- at least one tunnel that spatially intercommunicates two adjacent ones of said trenches.
Dependencies are inferred from the claim text.