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US 10,239,182 B2Granted
Polishing pad and polishing method
AssigneeIV Technologies CO., Ltd.
InventorsYi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen
Life of this patent
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Abstract
A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.
Claims15
A polishing pad, comprising:
- a polishing layer;
- and
- a detection window, disposed in the polishing layer, wherein a modulus of the detection window is larger than a modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.
A polishing pad, comprising:
- a polishing layer;
- and
- a detection window, disposed in the polishing layer, wherein a ratio of a modulus of the polishing layer to a modulus of the detection window at 50° C. is greater than or equal to 1.4.
A polishing pad, comprising:
- a polishing layer;
- and
- a detection window, disposed in the polishing layer, wherein a ratio of a modulus of the detection window at 50° C. to the modulus of the detection window at 30° C. is less than or equal to 0.5.
Dependencies are inferred from the claim text.