Stage for cutting substrate and substrate-cutting apparatus
AssigneeSamsung Display Co., Ltd.
InventorsWonwoo Choi, Seungho Yoon, Sangbong Lee
Life of this patent
Estimating the term…
Abstract
Provided are a stage for cutting a substrate and a substrate-cutting apparatus. The stage for cutting a substrate includes: a plurality of cell areas, each of the cell areas including a first opening; an edge area at an outer side of the cell areas, the edge area including a second opening having a diameter that is larger than a diameter of the first opening; a dummy area between adjacent ones of the cell areas; and a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area.
Claims20
A stage for cutting a substrate, the stage comprising:
- a plurality of cell areas, each of the cell areas comprising a first opening;
- an edge area at an outer side of the cell areas, the edge area comprising a second opening having a diameter that is larger than a diameter of the first opening;
- a dummy area between adjacent ones of the cell areas;
- and
- a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area.
A substrate-cutting apparatus comprising:
- a stage for accommodating a substrate, the stage comprising:
- a plurality of cell areas, each of the cell areas comprising a first opening;
- an edge area at an outer side of the cell areas, the edge area comprising a second opening having a diameter that is larger than a diameter of the first opening;
- a dummy area between adjacent ones of the cell areas;
- and
- a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area;
- and
- a laser module for irradiating a laser beam onto the substrate,
- wherein the laser beam is irradiated onto the substrate along the cutting groove.
Dependencies are inferred from the claim text.