Alkenylphenoxy-substituted 1,1-diphenylethylenes, processes for their preparation, and their use
AssigneeEvonik Technochemie GmbH
InventorsSergey Evsyukov, Tim Pohlmann, Horst Stenzenberger, Matthijs Ter Wiel
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Abstract
The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, molding compounds, as well as structural and/or electrical composites.
Claims12
An alkenylphenoxy-1,1-diphenylethylene of formula (I):
- wherein:
- R1 is hydrogen or an alkenylphenoxy group,
- R2 is an alkenylphenoxy group, and
- R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms.
Dependencies are inferred from the claim text.