OLEDs for micro transfer printing

A structure, comprising:

• a source substrate comprising a patterned sacrificial layer;
• a dielectric layer disposed over and in contact with the patterned sacrificial layer, the patterned sacrificial layer disposed between the source substrate and the dielectric layer;
• an organic light-emitting diode (OLED) disposed on and in contact with the dielectric layer and exclusively over the patterned sacrificial layer, the OLED comprising a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material, wherein the first electrode and second electrode are both in contact with the dielectric layer;
• a protective layer disposed on or over the OLED and in direct contact with the dielectric layer around a periphery of the OLED to encapsulate the OLED;
• and
• one or more fracturable tethers disposed over the patterned sacrificial layer and extending from a periphery of the organic light-emitting diode that exclusively connect the OLED to one or more anchor portions of the source substrate.