Integrated circuit chip extractor
AssigneesBoe Technology Group Co., Ltd., Hefei Boe Optoelectronics Technology Co., Ltd.
InventorsYongkang Hou, Yu Zhang, Jianlei Yang
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Abstract
The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.
Claims11
An integrated circuit (IC) chip extractor for removing an IC chip from a panel, comprising a base plate and a heating head arranged on the base plate, wherein the heating head comprises a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion of the IC chip adjacent to a center of the panel;
- wherein delimiting struts are arranged on the base plate and are capable of abutting against an edge of the panel so as to enable the hook to be at a position corresponding to the IC chip.
Dependencies are inferred from the claim text.