Device for terminal heat dissipation and mobile terminal
AssigneeXi'an Zhongxing New Software Co., Ltd.
InventorYongliang Zhang
Life of this patent
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Abstract
The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield.
Claims18
A device for terminal heat dissipation, comprising:
- a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid;
- and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield;
- wherein a pore size of each micropore is less than 1/50 of a wavelength of the radio frequency signal of a shielding area in the shield, a thickness of the shield is 0.2 to 0.3 mm, a space between two micropores is greater than or equal to ¼ of the pore size of each micropore and less than or equal to ½ of the pore size of each micropore, and a number of the micropores is determined by the shield area corresponding to a surface of the heat source chip.
A mobile terminal comprising a device for terminal heat dissipation, wherein the device comprising:
- a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid;
- and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield;
- wherein a pore size of each micropore is less than 1/50 of a wavelength of the radio frequency signal of a shielding area in the shield, a thickness of the shield is 0.2 to 0.3 mm, a space between two micropores is greater than or equal to ¼ of the pore size of each micropore and less than or equal to ½ of the pore size of each micropore, and a number of the micropores is determined by the shield area corresponding to a surface of the heat source chip.
Dependencies are inferred from the claim text.