Methods of transferring electrically conductive materials
AssigneePPG Industries Ohio, Inc.
InventorsJaye Tyler, Paul F. Cheetham, Darren Burn, Gregory J. McCollum
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Abstract
Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.
Claims24
A method of transferring an electrically conductive material to a substrate, the method comprising:
- a) contacting at least a portion of a non-planar substrate with a layered structure comprising:
- (1) a dielectric material layer positioned over a carrier film;
- (2) an electrically conductive material layer comprising the electrically conductive material positioned over the dielectric material layer;
- and
- (3) an adhesive layer positioned over the electrically conductive material layer;
- and
- b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material layer adheres to the substrate.
A method of forming a layered structure for a heat stamping application comprising:
- a) applying a material to form a release coat layer over at least a portion of a carrier film;
- b) applying a dielectric material over the release coat layer to form a dielectric material layer;
- c) drying the dielectric material layer for a period of time ranging from 1 to 120 seconds;
- d) applying an electrically conductive material in a pattern over the dielectric material layer to form an electrically conductive material layer;
- e) drying the electrically conductive material layer for a period of time ranging from 1 to 180 seconds;
- f) applying an adhesive over at least a portion of the electrically conductive material layer to form an adhesive layer;
- and
- g) drying the adhesive layer for a period of time ranging from 1 to 120 seconds,
- wherein the layered structure is positioned over a non-planar substrate.
A method of transferring an electrically conductive material to a substrate, the method comprising:
- a) forming a layered structure from a method comprising:
- i) applying a material over at least a portion of a carrier film to form a release coat layer;
- ii) applying a dielectric material over the release coat layer to form a dielectric material layer;
- iii) drying the dielectric material layer;
- iv) applying an electrically conductive material in a pattern over at least a portion of the dielectric material layer to form an electrically conductive material layer;
- v) drying the electrically conductive material layer;
- vi) applying an adhesive over at least a portion of the electrically conductive material layer to form an adhesive layer;
- and
- vii) drying the adhesive layer;
- b) contacting at least a portion of a non-planar substrate with the layered structure;
- and
- c) applying heat and pressure to the substrate and layered structure for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material layer adheres to the substrate,
- wherein conductivity of the electrically conductive material layer increases after applying heat and pressure.
Dependencies are inferred from the claim text.