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US 10,219,387 B2Granted
Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate
AssigneeNVIDIA Corporation
InventorsLeilei Zhang, Ronilo V. Boja, Abraham Fong Yee, Zuhair Bokharey
Life of this patent
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Abstract
A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.
Claims22
A method, comprising:
- forming one or more holes in a thick substrate using a laser drilling technique, wherein forming the one or more holes in the thick substrate comprises activating a first laser on a first side of the thick substrate and activating a second laser on a second side of the thick substrate, wherein an axis of the first laser is substantially coaxial with an axis of the second laser and each hole in the one or more holes has a diameter that is less than 100 μm;
- re-forming the one or more holes formed via the laser drilling technique via a mechanical process;
- electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes;
- and
- filling the one or more plated holes with a non-conductive material,
- wherein the thick substrate comprises a dielectric layer having a thickness greater than or equal to 200 μm.
3 more elements
A method, comprising:
- forming one or more holes in a thick substrate using a laser drilling technique, wherein each hole in the one or more holes has a diameter that is less than 100 μm;
- re-forming the one or more holes formed via the laser drilling technique via a mechanical process;
- electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes;
- desmearing the one or more holes after the electroplating;
- and
- filling the one or more plated holes with a non-conductive material after the desmearing,
- wherein the thick substrate comprises a dielectric layer having a thickness greater than or equal to 200 μm.
4 more elements
Dependencies are inferred from the claim text.