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US 10,219,380 B2Granted
Electronic device module and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDo Jae Yoo, Jae Hyun Lim, Kyu Hwan Oh, Jong In Ryu
Life of this patent
Estimating the term…
Abstract
An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.
Claims17
An electronic device module comprising:
- a board including external connecting electrodes and mounting electrodes;
- an electronic device mounted on the mounting electrodes;
- a molded portion sealing the electronic device;
- connection conductors each having an end bonded to a respective external connecting electrode and penetrating through the molded portion to an opposite end thereof having an external terminal bonded thereto;
- and
- an insulating layer disposed between the board and the molded portion,
- wherein the insulating layer covers the external connecting electrodes, surrounds the connection conductors adjacent to where the connection conductors are bonded to the external connection electrodes, and abuts stepped profile surfaces of the connection conductors.
4 more elements
An electronic device module comprising:
- a board comprising electrodes and an insulating layer disposed on a surface thereof;
- a molded portion sealing the surface of the board;
- and
- connection conductors bonded to respective electrodes while penetrating through the molded portion and the insulating layer, and configured to contact the molded portion and the insulating layer,
- wherein the insulating layer covers the electrodes, surrounds the connection conductors adjacent to where the connection conductors are bonded to the electrodes, and abuts stepped profile surfaces of the connection conductors.
2 more elements
An electronic device module comprising:
- a board including external connecting electrodes and mounting electrodes;
- an electronic device mounted on the mounting electrodes;
- an insulating layer sealing the board;
- and
- connection conductors disposed within the insulating layer, bonded to the external connecting electrodes and extending to an outside of the electronic device module,
- wherein the insulating layer surrounds the connection conductors, covers the external connecting electrodes adjacent to where the connection conductors are bonded to the external connecting electrodes, and abuts stewed profile surfaces of the connection conductors.
3 more elements
Dependencies are inferred from the claim text.