Light-emitting diode apparatus and method for manufacturing a light-emitting diode apparatus

A method for producing a light-emitting diode apparatus, comprising:

• providing a light-emitting diode element having a front side and a rear side,
• wherein the front side has an emission region for the purpose of emitting electromagnetic waves and a first diode connection contact associated with the emission region, and
• wherein the rear side of the light-emitting diode element has a second diode connection contact;
• providing a printed circuit board having a through-opening and a board connection contact;
• joining the light-emitting diode element to the printed circuit board,
• wherein the front side of the light-emitting diode element is connected to the printed circuit board, and
• wherein the emission region is arranged opposite the through-opening and the first diode connection contact is arranged opposite the board connection contact and is electrically conductively connected to the board connection contact;
• and
• providing a covering unit having a covering unit contact,
• wherein the covering unit contact is arranged opposite the second diode connection contact and is electrically connected to the second diode connection contact.

A light-emitting diode apparatus, comprising:

• a light-emitting diode element having a front side and a rear side, the front side of the light-emitting diode element having an emission region for emitting electromagnetic waves and a first diode connection contact and the rear side of the light-emitting diode element having a second diode connection contact;
• a printed circuit board having a through-opening and a board connection contact, the board connection contact being connected to the first diode connection contact;
• and
• a covering unit having a recess for receiving the light-emitting diode element and having a covering unit contact, the covering unit being connected to the printed circuit board,
• wherein the light-emitting diode element is arranged in the recess and the emission region is arranged opposite the through-opening, and
• wherein the covering unit contact is electrically connected to the second diode connection contact.