Printed wiring board
AssigneeIbiden Co., Ltd.
InventorTeruyuki Ishihara
Life of this patent
Estimating the term…
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AssigneeIbiden Co., Ltd.
InventorTeruyuki Ishihara
Estimating the term…
A printed wiring board includes a first insulating layer, a second conductor layer including first and second circuits, a second insulating layer covering the second conductor layer on the first insulating layer, a third conductor layer including first and second circuits, a third insulating layer covering the third conductor layer on the second insulating layer, a fourth conductor layer including first circuit, a second via conductor connecting the first circuits in the second and third conductor layers through the second insulating layer, and a first skip via conductor penetrating through the second circuit in the third conductor layer and connecting the second circuit in the second conductor layer and the first circuit in the fourth conductor layer through the second and third insulating layers. The second and third conductor layers are formed such that the second conductor layer has thickness t2 larger than thickness t3 of the third conductor layer.
A printed wiring board, comprising:
Dependencies are inferred from the claim text.