Circuit board
AssigneeShinko Electric Industries Co., Ltd.
InventorTatsuaki Denda
Life of this patent
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Abstract
A circuit board includes a rigid board including a first wiring layer formed on its upper surface side, and a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and a via wiring formed in a through-hole passing through the second wiring layer and the base material. The via wiring has a protrusion protruding from an upper surface of the second wiring layer, and extending on the upper surface of the second wiring layer positioned on an outer circumferential side of the through-hole.
Claims7
A circuit board comprising:
- a rigid board including a first wiring layer formed on its upper surface side;
- and
- a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and a via wiring formed in a through-hole passing through the second wiring layer and the base material,
- wherein the via wiring has a protrusion protruding from an upper surface of the second wiring layer, and extending on and directly contacting the upper surface of the second wiring layer positioned on an outer circumferential side of the through-hole, and at an end portion of the through-hole positioned on a side of the protrusion of the via wiring, an edge portion of the upper surface of the second wiring layer is rounded.
Dependencies are inferred from the claim text.