Laminated light guide and carrier having a circuit board with light emitting diodes and through bores with a light guide disposed therein with an opaque film overlapping the through bore

A laminated light guide and component carrier, comprising:

• a printed circuit board having a light emitting diode connected to a first face of the printed circuit board;
• a through bore created in the printed circuit board proximate to the light emitting diode;
• an opaque film applied using an adhesive to a second face of the printed circuit board oppositely directed with respect to the first face, the opaque film having a portion overlapping the through bore;
• a light guide positioned within the through bore and affixed to the portion of the opaque film overlapping the through bore;
• and
• a white film applied or ink printed onto the light guide without contacting the first face of the printed circuit board.

A laminated light guide and component carrier, comprising:

• a printed circuit board having multiple light emitting diodes connected to a first face of the printed circuit board;
• multiple through bores created in the printed circuit board each positioned proximate to one of the light emitting diodes;
• an opaque film applied to a second face of the printed circuit board oppositely directed with respect to the first face, the opaque film having multiple portions, each of the portions individually overlapping one of the through bores;
• multiple light guides each formed to be slidably received within one of the through bores and bonded about a perimeter of the light guide to the adhesive present on one of the multiple portions of the opaque film, the light guides each including a light reflector defining a texturally modified area;
• a white film applied or ink printed onto each of the light guides without contacting the first face of the printed circuit board and positioned proximate to the light reflector of each of the light guides to maximize light reflected toward an opening created in the opaque film;
• and
• an opaque polymeric material layer commonly applied over the first face of the printed circuit board, the light emitting diodes, the light guides and each white film, and extending beyond a perimeter of the printed circuit board.