Multilayer printed circuit board capable of reducing transmission loss of high speed signals

A multilayer printed circuit board comprising:

• a first outer circuit layer comprising a first trace configured to transmit a high frequency signal;
• an inner circuit layer comprising a second trace, wherein the first outer circuit layer is formed at one side of the inner circuit layer;
• a second outer circuit layer formed at another side of the inner circuit layer;
• a via formed from the first outer circuit layer to the second outer circuit layer, and coupled to the first trace and the second trace, wherein the second trace is coupled to the first trace through the via for transmitting the high frequency signal;
• a layer of high dielectric dissipation solder resist ink formed on a terminal of an open stub of the via exposed outside of the second outer circuit layer;
• and
• a layer of low dielectric dissipation solder resist ink covering the second outer circuit layer and the layer of high dielectric dissipation solder resist ink.