# US 10,214,414 B2 · Integrated MEMS system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,214,414 B2 - Document ID: US10214414B2 - Status: Granted - Kind: B2 - Application number: 15/206,935 - Filed: 2016-07-11 - Published: 2016-11-03 - Granted: 2019-02-26 - Earliest claimed: 2014-01-09 - Assignees: Motion Engine Inc. - Applicants: Motion Engine, Inc. - Inventors: Robert Mark Boysel; Louis Ross - Web page: https://patentgrep.com/patent/US10214414B2 ## CPC - B81B 7/007: {Interconnections between the MEMS and external electrical signals} - B81C 1/00238: {Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure} - G01P 15/0802: {Details} - G01P 15/125: by capacitive pick-up - G01P 15/18: in two or more dimensions - B81B 2201/0235: Accelerometers - B81B 2201/0242: Gyroscopes - B81B 2201/0257: Microphones or microspeakers - B81B 2201/0264: Pressure sensors - B81B 2201/0278: Temperature sensors - B81B 2201/0292: Sensors not provided for in B81B2201/0207 - B81B2201/0285 - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - B81B 2207/07: Interconnects - H10W 90/722: {between stacked chips} - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G}) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An integrated MEMS system having a MEMS chip, including a MEMS transducer, and at least one IC chip, including MEMS processing circuitry, and additional circuitry to process electrical signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducer and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct electrical signals to the IC chip, to be processed by additional circuitry. ## Claims ### Claim 1 An integrated micro-electro-mechanical (MEMS) system comprising: at least one MEMS chip comprising: a first cap layer including a first set and a second set of first cap MEMS electrical contacts; a second cap layer comprising second cap MEMS electrical contacts; a central MEMS layer located between the first cap layer and the second cap layer; at least one transducer formed in the first cap layer, the central MEMS layer and the second cap layer, the at least one transducer producing motion or sensing at least one parameter; first insulated conducting pathways connecting said at least one transducer to the first set of first cap MEMS electrical contacts, the first insulated conducting pathways conducting electrical MEMS signals between said at least one transducer and the first set of the first cap MEMS electrical contacts; and second insulated conducting pathways connecting the second set of first cap MEMS electrical contacts to at least one of the second cap MEMS electrical contacts, the second insulated conducting pathways extending through the first cap layer, the central MEMS layer, and the second cap layer, for conducting further signals through the MEMS chip; and at least one signal integrated circuit (IC) chip comprising: a first set and a second set of IC electrical contacts, the first set of IC electrical contacts being bonded to the first set of first cap MEMS electrical contacts and the second set of IC electrical contacts being bonded to the second set of first cap MEMS electrical contacts; MEMS signal processing circuitry, operatively connected to the first set of IC electrical contacts, the MEMS signal processing circuitry configured to process the electrical MEMS signals; and second signal processing circuitry, operatively connected to the second set of IC electrical contacts, the second signal processing circuitry configured to process the further signals. ### Claim 2 (depends on 1) The integrated MEMS system according to claim 1, wherein the first cap layer, the central MEMS layer and the second cap layer are made of an electrically conducting material, the first cap layer being electrically bonded to a first side of the central MEMS layer, and the second cap layer being electrically bonded to a second side of the central MEMS layer, opposite the first side. ### Claim 3 (depends on 1) The integrated MEMS system according to claim 1, wherein the first cap layer, the central MEMS layer and the second cap layer are fabricated from respective silicon wafers bonded at wafer level. ### Claim 4 (depends on 1) The integrated MEMS system according to claim 1, wherein the central MEMS layer comprises a silicon on insulator wafer and includes a moveable mass in a range of 0.5-1.5 milligrams, or in a range of 1.5-3 milligrams or in a range of 3-6 milligrams. ### Claim 5 (depends on 1) The integrated MEMS system according to claim 1, wherein the second insulated conducting pathways are formed by one or more trenches etched in at least one of the first layer, the central MEMS layer and the second layer, said one or more trenches being aligned and filled with an insulating material, the one or more trenches surrounding respective conductive wafer plugs, the conductive wafer plugs configured to transmit electrical signals though the entire thickness of the MEMS chip. ### Claim 6 (depends on 1) The integrated MEMS system according to of claim 1, wherein at least a plurality of the second insulated conducting pathways are formed by trenches etched in one of the first layer, the central MEMS layer and the second layer, said trenches being aligned and having their respective sidewalls lined with an insulating material and filled with a conductive material. ### Claim 7 (depends on 1) The integrated MEMS system according to claim 1, wherein the first MEMS electrical contacts and second cap MEMS electrical contacts of the first cap layer and the second cap layer are bond pads. ### Claim 8 (depends on 1) The integrated MEMS system according to claim 1, wherein said at least one transducer comprises a six degree of freedom motion sensor, and wherein said at least one parameter comprises three axes of linear acceleration and three axes of angular rate. ### Claim 9 (depends on 8) The integrated MEMS system according to claim 8, wherein said six degree of freedom motion sensor comprises a first set of electrodes and a second set of electrodes, the first set of electrodes positioned in the first cap layer and the second set of electrodes positioned in the second cap layer and a plurality of proof masses positioned in the central MEMS layer, the first and second sets of electrodes forming capacitors with the plurality of proof masses, a plurality of the first insulated conducting pathways configured to connect the first set of electrodes and the second set of electrodes to at least a plurality of the first cap MEMS electrical contacts of the first set of MEMS electrical contacts. ### Claim 10 (depends on 1) The integrated MEMS system according to claim 1, wherein said at least one transducer comprises at least one non-inertial sensor. ### Claim 11 (depends on 10) The integrated MEMS system according claim 10, wherein said at least one non-inertial sensor comprises at least one of a pressure sensor, a magnetometer, a thermometer, and a microphone. ### Claim 12 (depends on 10) The integrated MEMS system according to claim 10, wherein said at least one non-inertial sensor comprises non-inertial electrodes patterned in the first layer and at least one MEMS structure patterned in the central MEMS layer, a plurality of the first insulated conducting pathways connect said electrodes of the at least one non-inertial sensor to at least one of the first set of first cap MEMS electrical contacts. ### Claim 13 (depends on 1) The integrated MEMS system according to claim 1, wherein at least one of the electrical MEMS signals are analog signals, the IC chip comprising mixed signal CMOS circuitry to convert analog signals transmitted by the MEMS chip into digital signals, the digital signals being processed by the MEMS signal processing circuitry, and wherein the mixed signal CMOS circuitry is configured to convert digital signals transmitted by the MEMS signal processing circuitry into analog signals for connection to the MEMS chip. ### Claim 14 (depends on 1) The integrated MEMS system according to claim 1, wherein the IC chip comprises a digital bus, the MEMS signal processing circuitry comprising digital CMOS circuitry connected to said mixed signal circuitry via said digital bus. ### Claim 15 (depends on 14) The integrated MEMS system according to claim 14, wherein the digital CMOS circuitry comprises at least one of: a digital data analysis circuitry, a digital input/output circuitry, a memory, a system controller and a calibration/compensation circuit. ### Claim 16 (depends on 14) The integrated MEMS system according to claim 14, wherein the IC chip comprises a power bus and wherein the further signal processing circuitry comprises power management circuitry connected to the power bus and to the digital bus. ### Claim 17 (depends on 14) The integrated MEMS system according to claim 14, wherein the IC chip comprises high speed CMOS circuitry connected to the digital bus, for processing the further signals. ### Claim 18 (depends on 17) The integrated MEMS system according to claim 17, wherein the high speed CMOS circuitry comprises at least one of an input-output module for wireless or GPS signals. ### Claim 19 (depends on 1) The integrated MEMS system according to claim 1, wherein said at least one single MEMS chip comprises a first single MEMS chip and at least one additional single MEMS chip, the first single MEMS chip and said at one additional single MEMS chip being stacked vertically, the second layer of the first single MEMS chip being bump bonded to the first layer of said at least one additional single MEMS chip, the second insulated conducting pathways of said at least additional single MEMS chip being electrically connected to at least one of the second insulated conducting pathways of the first single MEMS chip, for conducting auxiliary signals through the first MEMS chip and said at least one additional single MEMS chip, to the at least one IC chip. ### Claim 20 (depends on 19) The integrated MEMS system according to claim 19, wherein the first MEMS chip comprises a third set of first cap MEMS electrical contacts and third insulated conducting pathways connecting the first cap MEMS electrical contacts of the third set to at least some of the second cap MEMS electrical contacts, through the first cap layer, the central MEMS layer and the second cap layer, said third insulated conducting pathways being electrically connected to the MEMS signal processing circuitry of the at least one IC chip, and being electrically connected to insulated conducting pathways of said at least one additional single MEMS chip, the MEMS signal processing circuitry processing the electrical MEMS signals of the first MEMS chip and of said at least one additional single MEMS chips. ### Claim 21 (depends on 1) The integrated MEMS system according to claim 1, wherein said at least one single IC chip comprises a first single IC chip and at least one additional single IC chip. ### Claim 22 (depends on 1) The integrated MEMS system according to claim 1, further comprising a first proof mass having a thickness in a range of 100 microns to 1000 microns. ### Claim 23 (depends on 22) The integrated MEMS system according to claim 22, further comprising a second proof mass having a thickness in a range of 100 microns to 1000 microns. ### Claim 24 (depends on 23) The integrated MEMS system according to claim 23, further comprising a controller configured to operate the first proof mass and the second proof mass in an antiphase drive mode.