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US 10,213,943 B2Granted
Composition
AssigneeToyo Gosei Co., Ltd.
InventorsTaigo Akasaki, Risa Wada, Takeshi Osaki
Life of this patent
Estimating the term…
Abstract
A suitable combination of a composition for formation of a resin mold with a pattern and a composition for formation of resin to which the pattern is transferred from the resin mold is found.
Claims3
A method of manufacturing a component, the method comprising:
- providing a first composition containing a photoinitiator;
- providing a resin mold with a pattern;
- curing the first composition to form a film to which a pattern is transferred from the resin mold having the pattern;
- and
- separating the film from the resin mold, wherein:
- when the resin mold's Shore hardness D is from 1 to 50, the film's Shore hardness is between 1 and 100, or
- when the resin mold's Shore hardness D is from 51 to 60, the film's Shore hardness is between 1 and 60;
- and
- the first composition contains at least one compound A represented by chemical formula (1) and a compound B represented by chemical formula (2),
- wherein, in formula (1),
- each of R1 and R2 is a hydrogen atom or methyl group;
- each of R3 and R4 represents a substituent including at least one atom selected from the group consisting of hydrogen atom, carbon atom, nitrogen atom, and sulfur atom;
- and
- “n” denotes an integer from 1 to 10,
- wherein, in formula (2),
- each of R5 and R6 is a hydrogen atom or methyl group;
- each of R7 and R8 represents a substituent including at least one atom selected from the group consisting of hydrogen atom, carbon atom, nitrogen atom, and sulfur atom;
- and
- each of “m” and “r” denotes an integer from 1 to 30.
16 more elements
Dependencies are inferred from the claim text.