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US 10,211,810 B2Granted
Acoustic wave filter and method for manufacturing the same
AssigneeSamsung Electo-Mechanics Co., Ltd.
InventorWon Kyu Jeung
Life of this patent
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Abstract
An acoustic wave filter includes a substrate having voids formed therein; a first resonator disposed on one or more of the voids, and a second resonator disposed on other of the voids. A first trimming layer is provided in the first resonator, and a second trimming layer is provided in the second resonator. The second trimming layer is formed of a material having an etching rate for a given etchant different from that of the first trimming layer.
Claims16
An acoustic wave filter comprising:
- a substrate having voids formed therein;
- a first resonator disposed on one or more of the voids;
- a second resonator disposed on another of the voids;
- a first trimming layer disposed in the first resonator and comprising a first material selected from the group consisting of Mn, Al, Cu, Ag, and an alloy of Mn, Al, Cu, or Ag;
- and
- a second trimming layer disposed in the second resonator, and comprising a second material different from the first material and selected from the group consisting of Mn, Al, Cu, Ag, and an alloy of Mn, Al, Cu, or Ag,
- wherein the first and second materials have respective etching rates for a given etchant that are configured to prevent one of the first and second trimming layers from being etched by the given etchant while the other of the first and second trimming layers is etched by the given etchant.
4 more elements
A method of manufacturing an acoustic wave filter, the method comprising:
- forming voids in a substrate;
- forming a first lower electrode and a second lower electrode to be disposed on the voids;
- forming a first piezoelectric body and a second piezoelectric body on the first lower electrode and the second lower electrode respectively;
- forming a first upper electrode and a second upper electrode on the first piezoelectric body and the second piezoelectric body respectively;
- forming a first trimming layer on the first upper electrode;
- and
- forming a second trimming layer on the second upper electrode,
- wherein the first trimming layer comprises a first material selected from the group consisting of Mn, Al, Cu, Ag, and an alloy of Mn, Al, Cu, or Ag, the second trimming layer comprises a second material different from the first material and selected from the group consisting of Mn, Al, Cu, Ag, and an alloy of Mn, Al, Cu, or Ag, and the first and second materials have respective etching rates for a given etchant that are configured to prevent one of the first and second trimming layers from being etched by the given etchant while the other of the first and second trimming layers is etched by the given etchant.
5 more elements
An acoustic wave filter, comprising:
- a first acoustic resonator having a first trimming layer disposed thereon;
- and
- a second acoustic resonator having a second trimming layer disposed thereon,
- wherein the first trimming layer is formed of a first material selected from the group consisting of Mn, Al, Cu, Ag, and an alloy of Mn, Al, Cu, or Ag, the second trimming layer is formed of a second material different from the first material and selected from the group consisting of Mn, Al, Cu, Ag, and an alloy of Mn, Al, Cu, or Ag, and the first and second materials have respective etching rates for a given etchant configured such that the given etchant etches one of the first and second trimming layers and causes no or negligible etching of the other of the first and second trimming layers.
1 more element
Dependencies are inferred from the claim text.