Power cable
AssigneeLs Cable & System Ltd.
InventorsJae Ik Lee, Won Sang Yoo, Kwang Mo Kim, Sung Tae Kang, Tae Hyun Lee
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Abstract
The present invention relates to a power cable. More particularly, the present invention relates to a power cable which is, when compared to the existing power cables, lightweight and includes a watertight layer which improves a corrosion resistance and is effectively suppressed from being peeled since the interlayer adhesiveness thereof is maintained regardless of an externally physical impact and a temperature change.
Claims24
A power cable comprising:
- a center conductor layer;
- an inner semiconducting layer provided on an outer surface of the center conductor layer;
- an insulating layer provided on an outer surface of the inner semiconducting layer;
- an outer semiconducting layer provided on an outer surface of the insulating layer;
- a metal layer provided on an outer surface of the outer semiconducting layer, the metal layer including a plurality of metal wires;
- a watertight layer provided on an outer surface of the metal layer;
- an adhesive layer having a density of 0.93 or greater and a degree of crystallinity of greater than 50%, the adhesive layer provided on an outer surface of the watertight layer;
- and
- a jacket layer provided on an outer surface of the adhesive layer.
A power cable comprising:
- a center conductor layer;
- an inner semiconducting layer provided on an outer surface of the center conductor layer;
- an insulating layer provided on an outer surface of the inner semiconducting layer;
- an outer semiconducting layer provided on an outer surface of the insulating layer;
- a metal layer provided on an outer surface of the outer semiconducting layer, the metal layer including a plurality of metal wires;
- a watertight layer provided on an outer surface of the metal layer;
- an adhesive layer provided on an outer surface of the watertight layer;
- a jacket layer provided on an outer surface of the adhesive layer;
- a first semiconducting layer provided between the outer semiconducting layer and the metal layer;
- a second semiconducting layer provided between the metal layer and the watertight layer;
- and
- an adhesion assisting layer provided between the watertight layer and the adhesive layer, wherein the adhesion assisting layer comprises an additive having adhesiveness to make a peel strength survival rate of the jacket layer with respect to the watertight layer be 70% or greater, when measured after immersing the power cable in an alkaline aqueous solution of pH 8.5 and a temperature of 80° C. for seven days.
A method of manufacturing a power cable including a conductor layer, an inner semiconducting layer covering the conductor layer, an insulating layer covering the inner semiconducting layer, an outer semiconducting layer covering the insulating layer, and a metal layer covering the outer semiconducting layer, the method comprising:
- forming a watertight layer by vertically adding a metal tape having an adhesion assisting layer stacked thereon on an outer surface of the metal layer, and adhering overlapping parts of opposite ends of the metal tape to each other;
- forming an adhesive layer by extruding resin having a density of 0.93 or greater and a degree of crystallinity of greater than 50% on an outer surface of the adhesion assisting layer at an extrusion temperature which is higher than or equal to a melting point of the adhesion assisting layer;
- and
- forming a jacket layer on an outer surface of the adhesive layer by extruding the jacket layer at an extrusion temperature which is higher than or equal to a melting point of the adhesive layer.
Dependencies are inferred from the claim text.