Highly thermally conductive valve seat ring
AssigneeBleistahl-Produktions GmbH & Co KG
InventorsEkkehard Kohler, Dirk Emde, Anna Seyfarth, Thomas Lelgermann
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Abstract
The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
Claims16
Powdermetallurgically produced valve seat ring comprising a carrier layer and a function layer, wherein the carrier material of the carrier layer has a total copper content ranging between >25 and 40% w/w to provide a thermal conductivity in excess of 55 W/m*K, characterized in that the carrier material contains an iron-copper alloy, the copper content of the iron-copper alloy exceeding 5% w/w, the materials of the carrier and the function layers containing copper added by infiltration.
Dependencies are inferred from the claim text.