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US 10,208,382 B2Granted
Method for making a seam-sealable non-magnetic lid and package
AssigneeGeneral Electric Company
InventorsChristopher James Kapusta, Marco Francesco Aimi
Life of this patent
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Abstract
A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
Claims23
A method for making a seam-sealable non-magnetic lid, the method comprising:
- forming a lid substrate from a blank consisting of molybdenum;
- depositing an adhesion layer onto the lid substrate;
- forming a copper seed layer on the adhesion layer;
- forming a palladium solder base layer on the copper seed layer;
- and
- coupling a gold/tin solder preform to the palladium solder base layer.
3 more elements
A method for making a non-magnetic hermetic package comprising:
- providing a package body comprising non-magnetic walls and a metallic non-magnetic seal ring disposed on a sealing edge of the non-magnetic walls;
- bonding a component within an interior cavity defined by the non-magnetic walls of the package body;
- providing a metallic non-magnetic lid comprising a gold/tin solder preform coupled to a lid substrate consisting of molybdenum, the metallic non-magnetic lid further comprising an adhesion layer, a palladium base solder layer, and a copper seed layer positioned between the adhesion layer and the palladium solder base layer;
- and
- seam sealing the gold/tin solder preform to the metallic non-magnetic seal ring.
2 more elements
A method of manufacturing a metallic, non-magnetic lid that is seam-sealable onto a package, the method comprising:
- providing a substrate consisting of molybdenum;
- and
- depositing an adhesion layer, a copper seed layer, and a palladium solder base layer sequentially onto at least one surface of the substrate, wherein depositing each layer is accomplished by using one of physical vapor deposition, chemical vapor deposition, and electroplating.
Dependencies are inferred from the claim text.