Production method for deposition mask
AssigneeV Technology Co., Ltd.
InventorMichinobu Mizumura
Life of this patent
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Abstract
A production method for a deposition mask is provided. The production method includes the steps of: forming a mask member having a structure in which a thin-board magnetic metal member having a through hole and a resin film contact tightly with each other; forming a mark that has a specified depth by irradiating a part of the film through the through hole of the mask member with laser beams; and forming an opening pattern that penetrates the film by irradiating a predetermined position with laser beams, using the mark as a reference.
Claims6
A production method for a deposition mask, the deposition mask comprising:
- a resin film in which multiple opening patterns each having a shape and dimensions that are the same as those of a corresponding one of multiple thin film patterns to be formed in a substrate are formed at positions corresponding to the multiple thin film patterns;
- and
- a sheet magnetic metal member in which multiple through holes each sized to include the corresponding opening pattern are formed, the magnetic metal member contacting tightly with the resin film,
- the production method comprising the sequential steps of:
- forming a mask member having a structure in which the magnetic metal member having the through holes and the resin film before forming the opening patterns, contact tightly with each other;
- placing the mask member and a reference substrate on a stage of a laser machining apparatus with the resin film of the mask member contacting tightly with the reference substrate, the reference substrate having a reference pattern, the laser machining apparatus including a first mask in which multiple first through holes for forming the opening patterns are provided at predetermined positions around, as a center, an optical axis of the laser machining apparatus, and a second mask in which a second through hole for forming a mark having a specified shape and a specified depth is provided so that the second through hole is centered on the optical axis;
- using an imaging device included in the laser machining apparatus to image the reference pattern and centering the reference pattern on the optical axis;
- forming the mark by irradiating a part of the film through a corresponding one of the through holes of the mask member with a laser beam using the second through hole of the second mask, the part being positioned correspondingly to that of the reference patterns of the reference substrate;
- using the imaging device to image the mark and centering the mark on the optical axis;
- and
- forming, at the same time, the opening patterns that penetrate the film by irradiating predetermined positions around the mark as a center with laser beams using the first through holes of the first mask.
Dependencies are inferred from the claim text.